Thermosetting resin composition and uses thereof

Details Thermosetting resin composition and uses thereof Thermosetting resin composition and uses thereof

2011-05-03

2011-05-03

Szekely, Peter (Department: 1761)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C524S126000

Reexamination Certificate

active

07935752

ABSTRACT:
The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 Êm or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.

REFERENCES:
patent: 5919844 (1999-07-01), Shimizu et al.
patent: 6420459 (2002-07-01), Hörold
patent: 7232876 (2007-06-01), Tamura et al.
patent: 7446140 (2008-11-01), Bauer et al.
patent: 0 249 723 (1987-12-01), None
patent: 1 088 584 (2001-04-01), None
patent: 1 229 389 (2002-08-01), None
patent: 9235449 (1997-09-01), None
patent: 09325490 (1997-12-01), None
patent: 10306201 (1998-11-01), None
patent: 11242331 (1999-09-01), None
patent: 11271967 (1999-10-01), None
patent: 2002284963 (2002-10-01), None
patent: 2003212954 (2003-07-01), None
patent: 2004137370 (2004-05-01), None
patent: 2005290134 (2005-10-01), None
patent: 2005325358 (2005-11-01), None
patent: 2006028249 (2006-02-01), None
patent: 03/005126 (2003-01-01), None
patent: 2005/018298 (2005-02-01), None
patent: 2006/088230 (2006-08-01), None
patent: 2006/106892 (2006-10-01), None
patent: 2007/059152 (2007-05-01), None

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