Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-05-24
2011-05-24
Fahmy, Wael M (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S691000, C257S777000
Reexamination Certificate
active
07948071
ABSTRACT:
An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of the first die to contacts on the substrate. A second die is placed on the first die, and wire leads electrically couple the bond pads of the second die to contacts on the substrate. Preferably, a spacer is placed between the first die and the second die. Additional dies may be stacked on the second die.
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Kim, G., “Pad-On-Circuit (PoC) Process and Its Application,” 10thAnnual International KGD Packaging & Test Workshop, Sep. 8-10, 2003, 27 pages, Napa, CA.
Grafe Jurgen
Hedler Harry
Pohl Jens
Thomas Jochen
Weitz Peter
Economou John S.
Fahmy Wael M
Kalam Abul
Qimonda AG
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