Low melting point frit paste composition and sealing method...

Details Low melting point frit paste composition and sealing method... Low melting point frit paste composition and sealing method...

2011-04-12

2011-04-12

Group, Karl E (Department: 1731)

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

C501S015000, C501S017000, C501S020000, C501S046000, C501S047000, C156S275500, C065S036000, C065S043000, C065S058000, C445S044000, C313S504000

Reexamination Certificate

active

07923393

ABSTRACT:
The present invention relates to a low melting point frit paste composition and a sealing method for an electric element using the same, and more particularly, to a low melting point frit paste composition which is sealable and appropriate for a flat panel, protects an element weak to heat and improves a process yield with good print properties, and a sealing method for an electric element using the same.

REFERENCES:
patent: 3885975 (1975-05-01), Malmendier et al.
patent: 5346863 (1994-09-01), Hikata et al.
patent: 2007/0090759 (2007-04-01), Choi et al.
patent: 2007/0170846 (2007-07-01), Choi et al.
patent: 2007/0194710 (2007-08-01), Song et al.
patent: 2009/0064717 (2009-03-01), Son et al.
patent: 2009/0065049 (2009-03-01), Son et al.
patent: 2009/0068917 (2009-03-01), Kim

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