Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-07-19
2011-07-19
Gupta, Yogendra N (Department: 1744)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
Reexamination Certificate
active
07981245
ABSTRACT:
A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.
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Egitto Frank D.
Farquhar Donald S.
Markovich Voya R.
Poliks Mark D.
Powell Douglas O.
Gupta Yogendra N
International Business Machines - Corporation
Petrokaitis, Esq. Joseph
Robitaille John P
Scully , Scott, Murphy & Presser, P.C.
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