Method of manufacturing a small form factor PCBA

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S592100, C029S760000, C206S561000, C206S564000, C206S565000, C206S718000, C206S707000, C206S725000, C228S049500

Reexamination Certificate

active

07921552

ABSTRACT:
A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates.

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