Dicing tape laminated with adhesive sheet of polymer, epoxy...

Details Dicing tape laminated with adhesive sheet of polymer, epoxy... Dicing tape laminated with adhesive sheet of polymer, epoxy...

2011-06-28

2011-06-28

Sellers, Robert (Department: 1765)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C428S423100, C428S424800, C428S473500, C428S474400, C428S475200, C428S476900, C428S480000, C428S493000, C428S515000, C428S516000, C428S518000, C428S520000, C428S523000, C523S445000, C523S457000, C523S466000, C523S467000, C525S117000, C525S120000, C525S134000, C525S185000, C525S390000, C525S396000, C525S420000, C525S423000, C525S429000, C525S437000, C525S438000, C525S453000, C525S454000, C525S446000, C525S461000, C525S463000, C525S481000, C525S502000, C525S524000

Reexamination Certificate

active

07968195

ABSTRACT:
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

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