Carbon film coated member

Coating apparatus – Gas or vapor deposition – Work support

Reexamination Certificate

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Details

C118S722000, C118S726000, C118S727000, C428S408000, C428S336000, C428S698000

Reexamination Certificate

active

07988786

ABSTRACT:
The present invention provides a carbon film coated member comprising: a base material; and a coated film formed on at least part of a surface of the base material, the coated film comprising: a matrix composed of amorphous carbon; and at least one of metal and metal carbide contained in the matrix, wherein an atomic ratio (M/C) of the metal (M) to carbon (C) constituting the coated film is 0.01 to 0.7. According to the above structure, there can be provided a carbon film coated member excellent in low-friction property, wear resistance and durability, and capable of suppressing a dust generation, peeling-off and deterioration of the coated film even if the carbon film coated member is used as semiconductor equipment members such as wafer cassette, dummy wafer, probe pin or the like under severe operating conditions, so that the carbon film coated member would not exert a bad influence onto the resultant semiconductor products.

REFERENCES:
patent: 5010249 (1991-04-01), Nishikawa
patent: 5164595 (1992-11-01), Musselman et al.
patent: 5249554 (1993-10-01), Tamor et al.
patent: 5270543 (1993-12-01), Visser et al.
patent: 5368937 (1994-11-01), Itoh
patent: 5368939 (1994-11-01), Kawamura et al.
patent: 5383354 (1995-01-01), Doris et al.
patent: 5763879 (1998-06-01), Zimmer et al.
patent: 5786068 (1998-07-01), Dorfman et al.
patent: 5952060 (1999-09-01), Ravi
patent: 6284376 (2001-09-01), Takenouchi et al.
patent: 6508911 (2003-01-01), Han et al.
patent: 6537429 (2003-03-01), O'Donnell et al.
patent: 6652969 (2003-11-01), Murakami et al.
patent: 6740393 (2004-05-01), Massler et al.
patent: 6821624 (2004-11-01), Utsumi et al.
patent: 6869676 (2005-03-01), Burger et al.
patent: 7067191 (2006-06-01), Derflinger et al.
patent: 527 133 (1993-02-01), None
patent: 0 579 983 (1993-06-01), None
patent: 1 114 881 (2001-07-01), None
patent: 62-185879 (1987-08-01), None
patent: 4-103777 (1992-04-01), None
patent: 05-279854 (1993-10-01), None
patent: 06-212429 (1994-08-01), None
patent: 09-237824 (1997-09-01), None
patent: 10-110270 (1998-04-01), None
patent: 10-221366 (1998-08-01), None
patent: 10-270433 (1998-10-01), None
patent: 11-029880 (1999-02-01), None
patent: 11-102847 (1999-04-01), None
patent: 11-254093 (1999-09-01), None
patent: 11-315924 (1999-11-01), None
patent: 2000-039446 (2000-02-01), None
patent: 2000-96233 (2000-04-01), None
patent: 2000-119843 (2000-04-01), None
patent: 2000-290776 (2000-10-01), None
patent: 2001-004698 (2001-01-01), None
patent: 2001-316800 (2001-11-01), None
patent: 99/55929 (1999-11-01), None
J.S. Wang et al., “The mechanical performance of DLC films on steel substrates”, Elsevier Science S.A. Thin Solid Films 325, (1998) pp. 163-174.
K. Bewilogua et al., “Erratum to: Effect of target material on deposition and properties of metal-containing DLC (Me-DLC) coatings”, Elsevier Science S.A., Surface and Coatings Technology 132, (2000), pp. 275-283.
W.J. Meng et al., “Mechanical properties of Ti-containing and W-containing diamond-like carbon coatings”, Journal of Applied Physics, vol. 84, No. 8, Oct. 15, 1998, pp. 4314-4321.
Grischke et al., “Application-oriented modifications of deposition processes for diamond-like-carbon-based coatings,” Surface and Coatings Technology, vol. 74-75, pp. 739-745, 1995.

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