Semiconductor device with hollow structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C267S251000, C267S251000, C267S251000, C267S251000, C267S251000, C267S251000, C267S251000, C267S251000

Reexamination Certificate

active

07952185

ABSTRACT:
A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.

REFERENCES:
patent: 6225692 (2001-05-01), Hinds
patent: 6969945 (2005-11-01), Namba et al.
patent: 7011986 (2006-03-01), Daeche et al.
patent: 2003/0205797 (2003-11-01), Takahashi et al.
patent: 2004/0018667 (2004-01-01), Joshi et al.
patent: 2005/0009315 (2005-01-01), Kim et al.
patent: 2005/0189621 (2005-09-01), Cheung
patent: 2005/0227401 (2005-10-01), Lee et al.
patent: 2005/0236644 (2005-10-01), Getten et al.
patent: 103 10 615 (2003-03-01), None
patent: 102 16 267 (2003-04-01), None
patent: 0 794 616 (1997-05-01), None
patent: 0 939 485 (1999-02-01), None
patent: 1 065 716 (2000-04-01), None
patent: 1 189 272 (2001-03-01), None
patent: 2000329632 (2000-11-01), None
patent: WO 2006/101270 (2006-09-01), None
Brunnbauer, M., et al., “An Embedded Device Technology Based on a Molded Reconfigured Water,” IEEE, 2006, pp. 547-551.

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