Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-05-31
2011-05-31
Vu, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C267S251000, C267S251000, C267S251000, C267S251000, C267S251000, C267S251000, C267S251000, C267S251000
Reexamination Certificate
active
07952185
ABSTRACT:
A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.
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Brunnbauer, M., et al., “An Embedded Device Technology Based on a Molded Reconfigured Water,” IEEE, 2006, pp. 547-551.
Beer Gottfried
Theuss Horst
Brinks Hofer Gilson & Lione
Chi Suberr
Infineon - Technologies AG
Vu David
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