Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-06-14
2000-05-16
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 361707, 361709, 361712, 361715, 361720, 165 802, 165185, 174 161, 174 163, H05K 720
Patent
active
06064575&
ABSTRACT:
A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.
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Butler Jeffrey T.
Kane Christopher J.
Urda Eugene J.
Chervinsky Boris L.
Lockheed Martin Corporation
Picard Leo P.
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