Feed thru with flipped signal plane using guided vias

Details Feed thru with flipped signal plane using guided vias Feed thru with flipped signal plane using guided vias

2011-02-01

2011-02-01

Jones, Stephen E (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Connectors and interconnections

C333S246000, C333S033000

Reexamination Certificate

active

07880570

ABSTRACT:
An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.

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