Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2011-04-26
2011-04-26
Nguyen, Ha Tran T (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S756020, C324S754030, C324S750240, C257S048000, C438S014000, C439S070000
Reexamination Certificate
active
07932739
ABSTRACT:
An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.
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Ji Chun Kui
Liang Shan An
Liao Ping Lung
Qin Tian
Chan Emily Y
Kilpatrick Townsend and Stockton LLP
Nguyen Ha Tran T
Semiconductor Manufacturing International (Shanghai) Corporation
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