Method for selectively forming symmetrical or asymmetrical...

Semiconductor device manufacturing: process – Chemical etching

Reexamination Certificate

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C438S690000, C438S691000, C438S692000, C216S037000, C427S198000

Reexamination Certificate

active

07985681

ABSTRACT:
A method for patterning a material during fabrication of a semiconductor device provides for the selective formation of either asymmetrical features or symmetrical features using a symmetrical photomask, depending on which process flow is chosen. The resulting features which are fabricated use spacers formed around a patterned material. If one particular etch is used to remove a base material, symmetrical features result. If two particular etches are used to remove the base material, asymmetrical features remain.

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Kim Jin Hong et al. IEEE Transactions on Electron Devices, Vo.46, No. 5, May 1999., pp. 984-992.

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