Method for double patterning lithography

Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle – Analysis and verification

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S054000, C716S055000, C716S119000, C700S098000, C700S120000, C700S121000, C430S005000, C378S035000

Reexamination Certificate

active

07913197

ABSTRACT:
According to various embodiments of the invention systems and methods for multiple pattern lithography, wherein a target layout pattern that is not capable of being printed in one lithography step is decomposed into multiple patterns that are printable in one lithography operation and, when appropriate, a continuous junction is utilized for where patterns overlap. In a further embodiment, where a continuous junction is not utilized, a splice is utilized at overlap locations. In yet another embodiment, where splices are utilized for overlap locations, identifying where critical nets are located in the target layout pattern, determining how close a component of the critical net is to a splice, and changing the target layout pattern as to avoid the condition of a component of the critical net being in proximity to a splice. In another embodiment of the invention, where splices are utilized at overlap locations, placing a landing pad of contacts or vias at the same location as the splice.

REFERENCES:
patent: 5059359 (1991-10-01), Hull et al.
patent: 6600965 (2003-07-01), Hull et al.
patent: 56054039 (1981-05-01), None
patent: 01290078 (1989-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for double patterning lithography does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for double patterning lithography, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for double patterning lithography will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2639804

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.