SiCOH dielectric material with improved toughness and...

Stock material or miscellaneous articles – Composite – Of silicon containing

Reexamination Certificate

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C428S446000, C427S578000, C427S588000, C438S788000, C438S789000, C438S790000

Reexamination Certificate

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07892648

ABSTRACT:
A low-k dielectric material with increased cohesive strength for use in electronic structures including interconnect and sensing structures is provided that includes atoms of Si, C, O, and H in which a fraction of the C atoms are bonded as Si—CH3functional groups, and another fraction of the C atoms are bonded as Si—R—Si, wherein R is phenyl, —[CH2]n— where n is greater than or equal to 1, HC═CH, C═CH2, C≡C or a [S]nlinkage, where n is a defined above.

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