Thin film encapsulation of MEMS devices

Details Thin film encapsulation of MEMS devices Thin film encapsulation of MEMS devices

2011-01-25

2011-01-25

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

C257SE29166

Reexamination Certificate

active

07875941

ABSTRACT:
A method of manufacturing a miniature electromechanical system (MEMS) device includes the steps of forming a moving member on a first substrate such that a first sacrificial layer is disposed between the moving member and the substrate, encapsulating the moving member, including the first sacrificial layer, with a second sacrificial layer, coating the encapsulating second sacrificial layer with a first film formed of a material that establishes an hermetic seal with the substrate, and removing the first and second sacrificial layers.

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