Substrate holding apparatus, polishing apparatus, and...

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S287000, C451S288000, C451S398000

Reexamination Certificate

active

07967665

ABSTRACT:
A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

REFERENCES:
patent: 3453783 (1969-07-01), Queen
patent: 3838464 (1974-09-01), Doyle
patent: 4910155 (1990-03-01), Cote et al.
patent: 5607341 (1997-03-01), Leach
patent: 5643053 (1997-07-01), Shendon
patent: 5655949 (1997-08-01), Clover
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5779456 (1998-07-01), Bowes et al.
patent: 5876265 (1999-03-01), Kojima
patent: 5899800 (1999-05-01), Shendon
patent: 5913718 (1999-06-01), Shendon
patent: 5989103 (1999-11-01), Birang et al.
patent: 6012964 (2000-01-01), Arai et al.
patent: 6019671 (2000-02-01), Shendon
patent: 6027398 (2000-02-01), Numoto et al.
patent: 6030275 (2000-02-01), Lofaro
patent: 6036587 (2000-03-01), Tolles et al.
patent: 6059638 (2000-05-01), Crevasse et al.
patent: 6068549 (2000-05-01), Jackson
patent: 6086457 (2000-07-01), Perlov et al.
patent: 6099387 (2000-08-01), Gilmer et al.
patent: 6110025 (2000-08-01), Williams et al.
patent: 6126517 (2000-10-01), Tolles et al.
patent: 6186865 (2001-02-01), Thornton et al.
patent: 6196896 (2001-03-01), Sommer
patent: 6213855 (2001-04-01), Natalicio
patent: 6293846 (2001-09-01), Oguri
patent: 6309290 (2001-10-01), Wang et al.
patent: 6336845 (2002-01-01), Engdahl et al.
patent: 6341995 (2002-01-01), Lai et al.
patent: 6354928 (2002-03-01), Crevasse et al.
patent: 6386947 (2002-05-01), Donohue
patent: 6435948 (2002-08-01), Molnar
patent: 6443815 (2002-09-01), Williams
patent: 6443823 (2002-09-01), Tolles et al.
patent: 6503134 (2003-01-01), Shendon
patent: 6609950 (2003-08-01), Kimura et al.
patent: 6634924 (2003-10-01), Ono et al.
patent: 6652357 (2003-11-01), Williams
patent: 6695681 (2004-02-01), Wolf
patent: 6852019 (2005-02-01), Togawa et al.
patent: 6857950 (2005-02-01), Hayashi et al.
patent: 6957998 (2005-10-01), Togawa
patent: 6976903 (2005-12-01), Williams
patent: 6986698 (2006-01-01), Molnar
patent: 7008300 (2006-03-01), Molnar
patent: 7066785 (2006-06-01), Park et al.
patent: 7134948 (2006-11-01), Tseng et al.
patent: 7198561 (2007-04-01), Chen et al.
patent: 7291057 (2007-11-01), Kimura et al.
patent: 7377836 (2008-05-01), Molnar
patent: 2002/0028629 (2002-03-01), Moore
patent: 2002/0042246 (2002-04-01), Togawa et al.
patent: 2002/0146970 (2002-10-01), Saldana et al.
patent: 2002/0188370 (2002-12-01), Saldana et al.
patent: 2003/0232576 (2003-12-01), Kimura et al.
patent: 2005/0095964 (2005-05-01), Hengel, Jr.
patent: 2006/0160474 (2006-07-01), Tseng et al.
patent: 2007/0293129 (2007-12-01), Togawa et al.
patent: 1 197 292 (2002-04-01), None
patent: 05-057603 (1993-03-01), None
patent: 11-000860 (1999-01-01), None
patent: 11-254311 (1999-09-01), None
patent: 2000-117626 (2000-04-01), None
patent: 2006/049269 (2006-05-01), None
Extended European Search Report issued Aug. 4, 2009 in European Application No. EP 08 01 7248, which is a foreign counterpart of the present application.
European Search Report issued Dec. 3, 2007 in the International (PCT) Application of which the present application is the U.S. National Stage.

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