Integrated circuit package system with multiple devices

Details Integrated circuit package system with multiple devices Integrated circuit package system with multiple devices

2011-04-05

2011-04-05

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S666000, C257S673000, C257S676000, C257S686000, C257S777000, C257SE23031, C257SE23032, C257SE23052, C257SE21499, C438S106000

Reexamination Certificate

active

07919848

ABSTRACT:
An integrated circuit package system includes: forming a die-attach paddle, an outer interconnect, and an inner interconnect toward the die-attach paddle beyond the outer interconnect; mounting an integrated circuit device over the die-attach paddle; connecting the integrated circuit device to the inner interconnect and the outer interconnect; encapsulating the integrated circuit device over the die-attach paddle; attaching an external interconnect under the outer interconnect; and attaching a circuit device under the die-attach paddle and extended laterally beyond opposite sides of the die-attach paddle.

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