Planarization method and system using variable exposure

Details Planarization method and system using variable exposure Planarization method and system using variable exposure

1997-10-15

2000-05-16

Rutledge, D.

Photocopying

Projection printing and copying cameras

Step and repeat

430 5, 430311, 438699, G03D 2742

Patent

active

060644664

ABSTRACT:
A method and system for planarization of a semiconductor wafer is disclosed. The disclosed system includes a mask with at least a medium density pattern, where the pattern dimensions are below the resolving power of an exposure system. Less than full intensity of the exposing radiation passes through the medium density pattern of the mask to a resist layer and does not completely expose the underlying resist. Through adapting at least a portion of the mask to account for surface irregularities of a wafer's surface, improved planarization of the surface is achieved.

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