Method and apparatus for bonding external leads

Details Method and apparatus for bonding external leads Method and apparatus for bonding external leads

1991-03-27

1992-03-03

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29739, 29740, 174 524, 2281802, H01R 4300, B23P 1900

Patent

active

050920316

ABSTRACT:
A method and apparatus for bonding external leads of a solid state device to a lead frame, where a positional discrepancy between the solid state device and the lead frame is corrected not only in X-Y directions but also in the rotational direction so as to perform a high accuracy bonding. Discrepancies in the rotational direction are calculated after detecting two points of the solid-state device, and a sunction head holding such solid-state device is rotated to correct such discrepancy. One portion of the solid-state device is further detected and the discrepancy in X-Y direction is calculated so as to correct the relative positional discrepancy of the solid-state device and the lead frame.

REFERENCES:
patent: 4295596 (1981-10-01), Doten et al.
patent: 4727645 (1988-03-01), Rodin et al.
patent: 4852250 (1989-08-01), Andrews
patent: 4868978 (1989-09-01), Seidel et al.
IBM Technical Disclosure vol. 12, No. 6 Nov. 1969, pp. 793-794 by W. R. Arnold et al.
IBM Technical Disclosure vol. 26, No. 7B Dec. 1983, pp. 3664-3665 by V. D. Lorenzo et al.

Affiliated with

Also associated with

Rating

Method and apparatus for bonding external leads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for bonding external leads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for bonding external leads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-263406