Light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257S100000

Reexamination Certificate

active

07910948

ABSTRACT:
A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

REFERENCES:
patent: 2006/0284209 (2006-12-01), Kim et al.
patent: 2007/0164408 (2007-07-01), Yeh et al.

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