Flip-flop semiconductor device packaging using an interposer

Details Flip-flop semiconductor device packaging using an interposer Flip-flop semiconductor device packaging using an interposer

2011-05-10

2011-05-10

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S112000, C438S123000

Reexamination Certificate

active

07939371

ABSTRACT:
A semiconductor device package, a method of fabricating a semiconductor device package and a method of testing an integrated circuit utilizing a semiconductor device package are disclosed. Embodiments create a flip-flop semiconductor device package by coupling multiple leadfingers to conductive pads of a semiconductor device using an interposer with electrically conductive traces. The semiconductor device may be positioned in a face-up orientation between the leadfingers such that a single surface of the interposer may couple to both the semiconductor device and the leadfingers. The flip-flop package offers improved signaling properties, durability, reliability, and package density at reduced cost given that the interposer is configurable, the traces offer more reliable and durable interconnections, the interposer enables use of a smaller semiconductor device with a higher density conductive pad arrangement to decrease package density, and the interposer is relatively inexpensive.

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