High-frequency bipolar transistor and method for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – With specified electrode means

Reexamination Certificate

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C257SE29026, C257SE29174

Reexamination Certificate

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07968972

ABSTRACT:
A high-frequency bipolar transistor includes an emitter contact adjoining an emitter connection region, a base contact adjoining a base connection region, and a collector contact adjoining a collector connection region. A first insulation layer is disposed on the base connection region. The collector connection region contains a buried layer, which connects the collector contact to a collector zone. A silicide or salicide region is provided on the buried layer and connects the collector contact to the collector zone in a low-impedance manner. A second insulation layer is disposed on the collector connection region but not on the silicide region.

REFERENCES:
patent: 5345097 (1994-09-01), Nakagawa
patent: 5850101 (1998-12-01), Iranmanesh
patent: 6028345 (2000-02-01), Johnson
patent: 6255716 (2001-07-01), Jeon
patent: 6627972 (2003-09-01), Ehwald et al.
patent: 2002/0027232 (2002-03-01), Shigematsu et al.
patent: 2002/0160562 (2002-10-01), Babcock et al.
patent: 2003/0052387 (2003-03-01), Boeck et al.
patent: 2003/0183845 (2003-10-01), Phillips
patent: 2002-527884 (2002-08-01), None
Japanese Office Action with English translation dated Mar. 1, 2011. No. 2006-500120.

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