Stacked integrated circuit package system

Details Stacked integrated circuit package system Stacked integrated circuit package system

2011-06-07

2011-06-07

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25013, C257S685000, C257S723000, C257S777000, C438S109000

Reexamination Certificate

active

07956449

ABSTRACT:
A stacked integrated circuit package system includes: forming a recessed integrated circuit package system having a first encapsulation over a first integrated circuit and an interior cavity in the first encapsulation; forming a mountable integrated circuit package system having a second integrated circuit over a carrier; and mounting the recessed integrated circuit package system over the mountable integrated circuit package system with the second integrated circuit within the interior cavity and the first integrated circuit coupled with the carrier.

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