Light-emitting diode device and method for fabricating the same

Details Light-emitting diode device and method for fabricating the same Light-emitting diode device and method for fabricating the same

2011-04-19

2011-04-19

Williams, Joseph L (Department: 2889)

Electric lamp and discharge devices

With luminescent solid or liquid material

Solid-state type

C257S099000, C257S100000

Reexamination Certificate

active

07928655

ABSTRACT:
A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.

REFERENCES:
patent: 2005/0051782 (2005-03-01), Negley et al.
patent: 2005/0093430 (2005-05-01), Ibbetson et al.
patent: 2007/0120463 (2007-05-01), Hayashi et al.
patent: 2008/0049430 (2008-02-01), Sakumoto

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