Thermoelectric module

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature

Reexamination Certificate

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Details

C257S470000, C257S625000, C257S930000, C257SE27008, C257SE29166, C136S203000, C136S204000

Reexamination Certificate

active

07982278

ABSTRACT:
A thermoelectric module has a first substrate, a second substrate spaced from the first substrate, a plurality of P type thermoelectric elements and N type thermoelectric elements arranged in the space between the first and second substrates, and a plurality of electrodes which connect the P type and N type thermoelectric elements in series. Each electrode is connected to a respective one of the plurality of P type thermoelectric elements at a first connection and a respective one of the plurality of N type thermoelectric elements in the space, and a sealant is located at an edge portion of the space. Each one of a series of first or outer electrodes closest to the edge portion of the space has a concave portion that is concaved in a direction departing from the edge portion of the space and is at a position between the first connection and the second connection.

REFERENCES:
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patent: 5362983 (1994-11-01), Yamamura et al.
patent: 5705434 (1998-01-01), Imanishi et al.
patent: 5886291 (1999-03-01), Imanishi et al.
patent: 5950067 (1999-09-01), Maegawa et al.
patent: 5982013 (1999-11-01), Kishi et al.
patent: 6391676 (2002-05-01), Tsuzaki et al.
patent: 2003/0041893 (2003-03-01), Shimakawa et al.
patent: 2009/0211619 (2009-08-01), Sharp et al.
patent: 2010/0119770 (2010-05-01), Hiroyama et al.
patent: 2000-286460 (2000-10-01), None
patent: 2000286460 (2000-10-01), None

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