Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2011-02-15
2011-02-15
Le, Vu (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S154000, C250S492200, C250S492300
Reexamination Certificate
active
07889908
ABSTRACT:
In the past, when a shape was corrected by adjusting parameters of a shape calculating equation proper for a measuring method used in measuring a two-dimensional or three-dimensional shape by correlating the parameters and a shape index value, the degree of freedom of modifying a shape by correction depended on a model equation used in the calculation of the shape, and therefore such a shape correction method was unsuitable for objects of correction having a number of shape variations. According to the present invention, the three-dimensional shape is corrected by fitting a curvature equation to a three-dimensional shape of a semiconductor pattern measured by any three-dimensional shape measuring method and by adjusting parameters of the curvature equation based on a shape index value separately calculated. The relations between the shape index value and the parameters are stored in a data base, and at the time of measurement the measured shapes are corrected based on the relations mentioned above.
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Price, J., Bingham, P., Tobin, K., and Karnowski, T., “Semiconductor Sidewall Shape Estimation using Top-Down CD-SEM Image Retrieval,” Proceedings of the 6th International Conference on Quality Control by Artificial Vision, SPIE vol. 5132, pp. 209-219, Apr. 2003.
Miyamoto Atsushi
Morokuma Hidetoshi
Tanaka Maki
Allison Andrae S
Antonelli, Terry Stout & Kraus, LLP.
Hitachi High-Technologies Corporation
Le Vu
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