Card connector circuit board

Electrical connectors – With circuit conductors and safety grounding provision – Grounding of coupling part

Reexamination Certificate

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Details

C174S262000, C174S261000

Reexamination Certificate

active

06312269

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a card connector circuit board which is mounted on a card connector that is mounted on a mother board and that is capable of accommodating cards, and which forms at least a portion of the circuit that is used to interconnect the cards and the mother board.
BACKGROUND OF THE INVENTION
An example of a card connector which uses a single circuit board for signal and ground connections between cards and a mother board is disclosed in Japanese Patent Application No. 9-22762. The card connector has card accommodating sections arranged in two stages, i.e., an upper stage card-accommodating section and a lower stage card-accommodating section. A circuit board is disposed along a back surface of the card connector, and it is used for mutual connections at a relatively high frequency. The circuit board contains four layers of circuit wiring; the inner two layers are used for signal lines, while the outer two layers are used for ground lines. However, a manufacturing process for making a four-layer circuit board is relatively complicated, and the manufacturing cost is also high. Accordingly, an important object of the present invention is to provide a card connector circuit board which is easy to manufacture, and which can provide good electrical characteristics with respect to the signal and ground lines.
SUMMARY OF THE INVENTION
The present invention is directed to a card connector circuit board which is mounted on the back surface of a card connector, and which has first and second card-connection sections that are respectively connected to a lower stage first card-accommodating section and an upper stage second card-accommodating section arranged in two stages in the card connector, a mother board connection section which is connected to a connecting section on the side of the mother board on which the card connector is mounted, and signal lines and ground lines that connect the first and second card-connection sections with the mother board connection section, a two-layer circuit structure is formed which has circuits only on two opposite surfaces of the circuit board, the signal lines include first signal lines which connect the first card-connection section and the mother board side connection section on one side of the circuit board, and second signal lines which connect the second card-connection section and the mother board side connection section on the other side of the circuit board, and the ground lines include first ground lines which connect the first card-connection section and the mother board side connection section on the first side of the circuit board, and a second ground line which is made wider than the first ground lines, and which connects the second card-side connection section and the first ground lines on the first side of the circuit board.
The ground lines further include third ground lines which connect the second card-connection section and the first ground lines on the second side of the circuit board.
The second ground line is formed as a ground surface which extends in a plane corresponding to the second card-connection section.
The ground surface is extended in the vicinity of both ends of the card connector circuit board so that the ground surface extends to the mother board connection section.
The ground surface is disposed so that the ground surface also overlaps with the ground connection sections of the first card-connection section.


REFERENCES:
patent: 3399372 (1968-08-01), Uberbacher
patent: 5026292 (1991-06-01), Pickles et al.
patent: 5322447 (1994-06-01), Okada
patent: 5580257 (1996-12-01), Harwath
patent: 5711679 (1998-01-01), Spickler et al.
patent: 5775923 (1998-07-01), Tomioka
patent: 5813883 (1998-09-01), Lin
patent: 6062904 (2000-05-01), Oguchi et al.
patent: 922762 (1997-01-01), None
Japanese Patent Application No. 9-22762.

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