Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Mounting or support feature of housed loudspeaker
Reexamination Certificate
2000-03-01
2001-10-23
Tran, Sinh (Department: 2643)
Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Mounting or support feature of housed loudspeaker
C381S345000, C381S152000, C181S156000, C181S150000
Reexamination Certificate
active
06307947
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates broadly to acoustical speakers. More particularly, this invention relates to low profile speaker enclosures.
2. State of the Art
Audio and video equipment is quickly becoming smaller as demand for more compact and more portable audio and video equipment (such as flat screen televisions and flat screen computer monitors) increases. Likewise, speaker components are being designed into smaller electronic equipment including computers, telephones, and even watches, and are shrinking in size to be more adaptably placeable within rooms. Audiophiles and videophiles are more often hooking up their video equipment to audio systems and placing speakers completely around a room to provide a surround sound effect. However, the conventional speakers are often bulky and take up valuable floor space. Even when mounted on a wall, the speakers are large and conspicuous, and undesirably protrude into a room. Therefore, audiophiles and videophiles seek audio and video equipment which is either inconspicuous within an environment or which can easily be hidden or concealed so that it does not disturb the decor of the environment. However, sound quality in the mid- and lower frequency ranges remain an ever important consideration when designing smaller speakers, as smaller enclosures typically result in reduced low frequency output.
Typical speaker enclosures often have sound ports which increase low frequency output. A sound port is an opening typically within the front face or the back of the speaker enclosure which passively emits relatively low frequency sound and provides the speaker with a greater frequency range. Sound ports formed in small enclosures are typically ineffective due to the difficulty of creating an effective port opening or port volume without sacrificing either the advantageous resonance properties of the enclosure or the structural integrity of the enclosure. Further, the small dimensions of compact enclosures makes it difficult to create an opening for a port which avoids whistling and whooshing noises due to sound vibration and air turbulence within the enclosure.
U.S. Pat. No. 4,903,300 to Polk discloses a compact speaker enclosure sized to be installed within a structural partition, such as within an existing wall cavity between standard wall studs. The speaker enclosure has a relatively small resonance chamber volume. In order to increase frequency response especially in the low frequency range, the speaker enclosure is ported such that it utilizes the cavity between the studs as an integral part of the resonance chamber, thereby reducing the required speaker enclosure volume and thereby reducing the required speaker enclosure size and thickness. While utilizing the pre-existing cavity between the wall studs allows for a reduced chamber volume requirement and allows the speaker enclosure to be formed considerably smaller than conventional speaker enclosures, it also requires that the speakers be installed preferably prior to installation of the sheetrock. Alternately, it entails making significant post-construction modifications to the existing wall (i.e. requiring a carpenter to cut a large enough hole in the existing sheetrock to fit the entire speaker enclosure through into the cavity, wire the speaker and mount it to the wall studs or rear partition within the wall cavity, and then repair the wall and paint). Further, if the speaker is to be installed within an exterior wall, the portion of the wall housing the speaker enclosure and forming a part of the resonance chamber must have the wall insulation removed prior to installation. This results in significant energy loss and cold pockets throughout the space, thereby adding to heating and cooling costs. Further, the speaker of Polk is only usable within walls which are hollow, i.e. walls formed from studs forming hollow channels, and not, e.g., in cement block walls.
SUMMARY OF THE INVENTION
It is therefore an object of the invention to provide a low profile speaker enclosure which has desirable sound reproduction characteristics.
It is another object of the invention to provide a low profile speaker enclosure having an effective port.
It is a further object of the invention to provide a low profile speaker enclosure which can be easily and economically formed.
It is an additional object of the invention to provide a low profile speaker enclosure which can be adapted for use and mounting in many applications.
According to one embodiment of the invention, a low profile speaker enclosure including a speaker housing and an electroacoustical transducer is provided. The speaker housing has a front face and a back each defining a length and a width, and a plurality of sides defining a thickness and at least partially separating the front face and the back. In the preferred embodiment, the front face and the back of the speaker housing are substantially parallel, and the thickness of the housing is substantially less than either of the length or the width of the housing.
The front face, the back, and the plurality of sides of the speaker housing substantially define a chamber. The front face defines a speaker aperture which opens into the chamber, and an electroacoustical transducer is mounted in the speaker aperture. At least one of the sides defines a side aperture. The back of the low profile speaker enclosure has a first portion and a second portion which together define a back aperture therebetween which opens to the chamber. The second portion of the back defines a channel having at one end the back aperture and at the other end the side aperture, thereby forming a port in the speaker. When the speaker is mounted on a mounting surface, e.g., a wall, the mounting surface and the second portion of the back substantially enclose the channel to form a pathway or port between the back aperture into the chamber and an external environment.
In the preferred embodiment, the housing length is at least ten times greater than the housing thickness, and the width is at least five times greater than the housing thickness. The speaker enclosure is preferably integrally molded from a rigid plastic, but also may be made from resins, wood, or composites. Further, the front face, side faces, and portions of the back face of the speaker enclosure may be formed having an undulating shape to reduce standing waves within the chamber.
Additional objects and advantages of the invention will become apparent to those skilled in the art upon reference to the detailed description taken in conjunction with the provided figures.
REFERENCES:
patent: 4509184 (1985-04-01), Yanagawa
patent: 4549631 (1985-10-01), Bose
patent: 4778027 (1988-10-01), Taylor
patent: 4899390 (1990-02-01), Takewa et al.
patent: 4903300 (1990-02-01), Polk
patent: 4923032 (1990-05-01), Nuernberger
patent: 4926487 (1990-05-01), Yoshida et al.
patent: 5036946 (1991-08-01), Yoshino
patent: 5335284 (1994-08-01), Lemons
patent: 5359158 (1994-10-01), Queen
patent: 5710395 (1998-01-01), Wilke
patent: 5883966 (1999-03-01), Kubo
Copies of Web pages on Infinitysystems.com for flat panel and ERS Series of in-wall loudspeakers, Mar. 2000, 10 pages.
Gallagher Thomas A
Gordon David P
Jacobson David S
Tran Sinh
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