Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
1998-05-21
2001-02-20
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S126000, C438S127000
Reexamination Certificate
active
06190945
ABSTRACT:
The invention relates to an integrated heat sink for an integrated circuit package.
BACKGROUND
Semiconductor devices, such as microprocessors, DRAMs, and ASICs, may contain millions of transistors. These semiconductor devices are typically encapsulated in plastic packages. During operation, these devices generate large amounts of heat. Heat increases a device's electrical resistance which slows down the device and may affect the device's overall performance. Heat also accelerates wear and tear on the device and may reduce the device's overall life expectancy. Therefore, it is desirable to remove heat from semiconductor devices and generally keep them as cool as possible.
U.S. Pat. No. 5,461,766 discloses a heat transfer device for a package in which the base of a heat sink is integrally formed into an integrated circuit package and is abutted to a die in the package. A portion of the heat sink projects from the package, forming a post. A heat transfer assembly having an aperture is heated until the aperture expands sufficiently to allow the heat transfer assembly to be fitted on the post with a minimum of force. Upon cooling, a tight joint is formed between the heat sink and the heat transfer assembly.
There is a need for a simple, cost effective structure for removing heat from integrated circuit packages.
SUMMARY
A heat transfer system for an integrated circuit package may be implemented by encapsulating an internal heat sink into an integrated circuit package. An external heat sink may be readily connected to the internal heat sink using a releasable connection such as a threaded connection or an adhesive connection using conductive paste. By aligning a surface of the encapsulated internal heat sink with a package surface, a good heat transfer surface is provided for heat transfer from an internal to an external heat sink.
In general, in one aspect the invention relates to a method of forming an integrated circuit package containing a semiconductor die including encapsulating the semiconductor die together with an internal heat sink. An external heat sink is connected to the internal heat sink.
In general, in another aspect the invention relates to a semiconductor device including a leadframe, a semiconductor die mounted to the leadframe, and a package body encapsulating the semiconductor die and leadframe. An internal heat sink is encapsulated in the package body with the die. A connector in the internal heat sink is adapted to connect to an external heat sink.
In general, in another aspect the invention relates to an apparatus for removing heat from a semiconductor device having a package body. The apparatus includes an encapsulant and an internal heat sink embedded in the encapsulant. An external heat sink is secured to the internal heat sink in thermal contact with the internal heat sink.
In general, in another aspect the invention relates to an integrated circuit assembly including a support structure and a plurality of integrated circuit devices mounted on the support structure. A heat sink is attached to the plurality of integrated circuit devices.
In general, in another aspect the invention relates to an integrated circuit device connectable to an external heat sink. The device includes a die and a heat sink secured to the die. The heat sink includes a threaded connection for threadedly connecting to the external heat sink.
In general, in another aspect the invention relates to an integrated circuit device including a die. A first heat sink is connected to the die. A second heat sink is secured to the first heat sink by a conductive adhesive.
REFERENCES:
patent: 3029505 (1962-04-01), Reichenbaum
patent: 3259814 (1966-07-01), Green
patent: 5461766 (1995-10-01), Burward-Hoy
patent: 5527743 (1996-06-01), Variot
patent: 5814536 (1998-09-01), Rostoker et al.
patent: 5933709 (1999-08-01), Chun
patent: 5963795 (1999-10-01), Schneider et al.
patent: 5972736 (1999-10-01), Malladi et al.
patent: 5989940 (1999-11-01), Nakajima
Jones Josetta I.
Micro)n Technology, Inc.
Niebling John F.
Trop Pruner & Hu P.C.
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