Metal working – Method of mechanical manufacture – Heat exchanger or boiler making
Reexamination Certificate
1999-10-06
2001-11-27
Rosenbaum, I Cuda (Department: 3726)
Metal working
Method of mechanical manufacture
Heat exchanger or boiler making
C029S890031, C165S080300
Reexamination Certificate
active
06321451
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink and a method for making the same, and particularly to a reliable heat sink with enhanced heat dissipating effectiveness and a method for making the same.
2. Description of Prior Art
As chips such as microprocessors contain more circuitry and operate at faster speeds, greater amounts of heat are generated, which must be effectively and timely dissipated, otherwise a malfunction or operational instability of the computer will result. Conventionally, a heat sink made from a heat conductive material, such as aluminum, is commonly used to remove the heat generated by a heat generating component, such as a CPU (central processing unit) or a chip in a computer. The heat sink is retained in direct contact with the heat generating component to dissipate the heat into the surrounding environment.
U.S. Pat. No. 5,038,858 discloses a conventional heat sink having a plurality of fins upwardly extending from a base plate thereof. The base plate is retained in direct contact with an upper surface of a chip to dissipate the heat into the surrounding environment via the fins. The fins are attached to the base plate by engaging with parallel grooves defined in the base plate. However, due to gaps inevitably defined between the fins and the base plate, the heat generated by the chip can not be effectively transmitted from the base plate to the fins, thereby significantly degrading the heat dissipating capability of the heat sink.
To overcome the above-mentioned problem, U.S. Pat. No. 5,625,229 discloses a heat sink which comprises a base plate and a corrugated heat dissipating member made of a thin metal. The heat dissipating member includes a repeated series of side wall portions, top walls and connecting portions. The heat dissipating member and the base plate are integrated with each other by bonding the connecting portions of the heat dissipating member with the base plate. Although no gap exists between the heat dissipating member and the base plate, the heat dissipating member and the base plate may separate from each other if the bond fails. In addition, since the adhesive is a material having poor heat conducting capability, the heat dissipating effectiveness of the heat sink is also degraded.
Therefore, an improved heat sink is desired which has fins and a base plate securely attached together thereby enhancing the heat dissipating effectiveness of the heat sink.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a method for making a heat sink having fins and a base plate securely integrated with one another.
Another object of the present invention is to provide a heat sink having its fins and its base plate securely integrated with each other to enhance the heat dissipating effectiveness of the heat sink.
In order to achieve the objects set forth, a heat sink in accordance with the present invention comprises a base plate for contacting a heat generating component in a computer and a plurality of heat dissipating fins upwardly extending from the base plate. Each fin includes a heat dissipating portion and a connecting portion integrated with the base plate by punching whereby concave sections are left in the connecting portion. The fins can be formed in various shapes by shearing and bending or by bending a metal sheet.
A method for making a reliable heat sink of the present invention is also provided. The method includes a preparing step, a punching step and a flattening step. The preparing step comprises manufacturing a base plate and a plurality of fins each including a connecting portion and a heat dissipating portion. The punching step comprises punching the connecting portions of the fins against the base plate so that they integrate with the base plate in such manner that concave sections are left in the connecting portions and convex sections are left on a lower surface of the base plate. The flattening step comprises flattening the convex sections of the base plate to maintain planarity of the base plate. Using this method, the fins are securely integrated with the base plate thereby enhancing the heat dissipating effectiveness of the heat sink.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
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Lee Hsieh-Kun
Lee Shun-Jung
Chung Wei Te
Cuda Rosenbaum I
Foxconn Precision - Components Co., Ltd.
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