Heat transfer device

Details Heat transfer device Heat transfer device

1999-11-29

2001-02-06

Picard, Leo P. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S700000, C165S104330, C165S080400, C174S015200, C016S223000, C016S342000

Reexamination Certificate

active

06185102

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a heat transfer device, and particularly to a heat transfer device which is pivotally assembled in a Notebook type computer for transmitting heat produced by the CPU of the Notebook type computer to the monitor thereof.
PRIOR ART DESCRIPTION
As the computing speed and the power capacity of electrical chips increases, the heat produced by the electrical chips increases. Heat transfer devices directly mounted to the surface of an electrical chip are commonly used for dissipating heat produced, thereby keeping the temperature of the chip within its operating range. U.S. Pat. Nos. 5,615,735; 5,537,343 and 5,541,811 disclose heat transfer devices which are directly attached on a mother board. Such heat transmitting elements dissipate the heat produced by an electrical chip, such as a central processing unit (CPU), mounted on the mother board, through heat conductive fin-like members. However, in practice, such heat transmitting elements are not efficient and can not meet increasingly higher requirements for dissipating heat.
U.S. Pat. No. 5,690,468 discloses another type of heat transfer device. This heat transfer device comprises a heat dissipating portion, a heat conduction pipe and a fan. The heat dissipating portion includes a rectangular base and a plurality of heat dissipating fins integrally extending upward from an upper surface of the base. The bottom surface of the base is closely attached to an electrical chip. The fan is mounted in the center of the upper surface of the base. The heat conduction pipes are fixed among heat dissipating fins formed on a lateral side of the base. This kind of heat transfer device is superior in heat dissipating efficiency. However, since a Notebook computer is strictly limited by a height requirement, this kind of heat transfer device is not suitable for use in a Notebook computer because of the device's bulky body.
Furthermore, the prior art heat transfer devices discussed above all dissipate heat through the Notebook computer's mother board, on which the electrical chips are mounted. For a Notebook computer user, this can be painful and unsustainable if the user operates the Notebook computer from his/her lap.
Accordingly, an improved heat transfer device is desired.
BRIEF SUMMARY OF THE INVENTION
A main object of the present invention is to provide a heat transfer device which is pivotally mounted to a Notebook computer and which efficiently dissipates heat produced by electrical chips in the Notebook computer.
Another object of the present invention is to provide a heat transfer device which dissipates heat produced by the electrical chips in a Notebook computer through a monitor panel of the Notebook computer.
A heat transfer device in accordance with the present invention comprises a heat conductive base, first and second cylindrical chambers defined in the heat conductive base and parallel to each other, a first heat conduction pipe fixed within the first cylindrical chamber, a second heat conduction pipe pivotally received in the second cylindrical chamber, and a sealing mechanism. One end of the first heat conduction pipe is secured within the first cylindrical chamber, while the other end thereof is attached to a heat-generating electrical element for absorbing heat produced by the electrical element and then transmitting the absorbed heat to the heat conductive base. One end of the second heat conduction pipe is pivotally mounted within the second cylindrical chamber, while the other end thereof is connected to a monitor panel of the Notebook computer for dissipating the heat transmitted by the heat conductive base to the exterior of the Notebook computer via the monitor panel. A heat-conductive lubricant surrounds the end of the second heat conduction pipe in the second cylindrical chamber thereby providing heat conduction and lubrication between the pipe and the chamber.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.


REFERENCES:
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patent: 5764482 (1998-06-01), Meyer, IV et al.
patent: 5781409 (1998-07-01), Mercedy, III
patent: 5796581 (1998-08-01), Mok
patent: 5822187 (1998-10-01), Garner et al.
patent: 5832987 (1998-10-01), Lowry et al.
patent: 5847925 (1998-12-01), Progl et al.
patent: 5910883 (1999-06-01), Cipolla et al.
patent: 6031716 (2000-02-01), Cipolla et al.

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