Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
1999-06-24
2001-11-27
Crispino, Richard (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S322000, C228S179100, C228S180500, C228S212000
Reexamination Certificate
active
06322659
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
This invention relates generally to bonding systems and, more particularly, to a system and method for dual head bonding.
BACKGROUND OF THE INVENTION
Bonding systems are used to complete an interconnection between an integrated circuit chip and lead fingers of a bonding strip by bonding together or electrically coupling a plurality of bond pads of the integrated circuit chip to corresponding lead fingers on the bonding strip. In mass production, the bonding strip often includes a plurality of integrated circuit chips that may be separated after the bond pads of each integrated circuit chip have been bonded to corresponding lead fingers on the bonding strip. Thus, the bonding strip often includes a plurality of strip units with each strip unit having a single integrated circuit chip electrically coupled to lead fingers of the bonding strip.
One example of a bonding system is a dual head bonding system. Dual head bonding systems generally have two bond heads adjacent and in close proximity to one another for simultaneously bonding different strip units of the same bonding strip. Clamps are generally used to secure the bonding strip in two places while the two bond heads simultaneously bond different strip units of the bonding strip. Additionally, the dual head bonding system generally includes a heater positioned adjacent the two bond heads for heating the bonding strip during bonding. The dual head bonding system also generally includes a transfer mechanism for positioning various strip units of the bonding strip adjacent the two bond heads and for transporting the bonding strip to and from the two bond heads.
Dual head bonding systems, however, suffer several disadvantages. For example, since both bond heads are used to simultaneously bond different strip units of the same bonding strip, the two bond heads must be positioned so that the distance between the two bond heads is a multiple of the distance between strip units of the bonding strip. Thus, processing different bonding strips requires repositioning each bond head for each different bonding strip. Additionally, as heat is applied to the bonding strip during the bonding process, bonding strip warpage occurs in an area of the bonding strip between the clamps due to temperature expansion of the bonding strip. As the bonding strip warps, the interconnection between the integrated circuit chip and the lead fingers of the bonding strip may become defective.
SUMMARY OF THE INVENTION
Accordingly, a need has arisen for an improved dual head bonding system and method. The present invention provides an improved dual head bonding system and method that addresses shortcomings of prior dual head bonding systems and improves efficiency.
According to one embodiment of the invention, a method for bonding includes positioning a bonding strip adjacent a sole first bond head, the bonding strip having a plurality of strip units, and bonding, with only the first bond head, a first number of the plurality of strip units. The method further includes transporting the bonding strip from the first bond head and positioning the bonding strip adjacent a sole second bond head, and bonding, with only the second bond head, a remaining number of the plurality of strip units on the bonding strip.
According to another embodiment of the invention, a bonding system includes a first bond head operable to bond a bonding strip, the bonding strip having a plurality of strip units. The system also includes a second bond head operable to bond the bonding strip. The system further includes a first indexer operable to successively position each of a first number of the plurality of strip units adjacent the first bond head and a second indexer operable to transfer the bonding strip from the first bond head to the second bond head and successively position each of a second number of the plurality of strip units adjacent the second bond head.
The invention provides several technical advantages. For example, in one embodiment of the invention, the dual head bonding system provides for greater reliability of the bonding strips by substantially eliminating heat related warpage of the bonding strip during the bonding process. In the same embodiment, the dual head bonding system provides greater efficiency than conventional dual head bonding systems by utilizing two indexers for retrieving, transporting, and sequencing bonding strips between the bond heads.
Other technical advantages will be readily apparent to one skilled in the art from the following figures, descriptions, and claims.
REFERENCES:
patent: 4301958 (1981-11-01), Hatakenaka et al.
patent: 4674670 (1987-06-01), Watanabe et al.
patent: 4887758 (1989-12-01), Suzuki et al.
patent: 5137201 (1992-08-01), Yamazaki et al.
patent: 5979743 (1999-09-01), Test
patent: 6206274 (2001-03-01), Ball
Giaudrone Larry
Sakakini Peter
Tekavec Randy V.
Brady III W. James
Crispino Richard
Garner Jacqueline J.
Shortsle Kevin P.
Telecky , Jr. Frederick J.
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