Coating processes – Electrical product produced
Reexamination Certificate
1999-02-25
2001-10-23
Talbot, Brian K. (Department: 1762)
Coating processes
Electrical product produced
C427S011000, C427S272000, C427S282000, C427S369000, C427S123000
Reexamination Certificate
active
06306456
ABSTRACT:
This application claims priority under 35 U.S.C.§§119 and/or 365 to 10-063388 filed in Japan on Mar. 13, 1998; the entire content of which is hereby incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method for coating conductive paste and forming an electrode on an external surface of an electronic component part and a conductive paste coating device to be used in such method.
2. Description of the Related Art
Up to now, methods for forming an external electrode by coating and baking conductive paste on an external surface of an electronic component part have been widely used. Examples of such conventional methods for coating such coating paste efficiently are shown in
FIGS. 6 and 7
.
In the conductive paste coating method shown in
FIG. 6
, a device constructed by combination of a slit plate
51
and a container
52
for coating conductive paste is used. In the slit plate
51
, a slit
53
cut from the upper surface
51
a
through the lower surface
51
b
is formed. The width of the opening on the side of the upper surface
5
l
a
of the slit
53
is made nearly equal to the width of an electrode to be formed on an electronic part
54
.
Conductive paste
55
fills the inside of the container
52
, which is for storing coating conductive paste. Also, inside the container
52
for coating conductive paste, a piston
56
is arranged. The piston
56
is connected to a driving source (not illustrated) and is movable upward and downward.
When conductive paste
55
is coated on an external surface of the electronic part
54
, the electronic part
54
is placed and held on the upper surface
5
l
a
of the slit plate
51
and the conductive paste
55
is coated on the external surface of the electronic part
54
by pushing the piston
56
up and pushing the conductive paste
55
up through the slit
53
.
The method shown in
FIG. 7
uses a rubber plate
58
on the upper surface of which a slit
57
is formed. The width of the slit
57
is made nearly equal to the width of an electrode to be formed on an external surface of an electronic part
54
. Also, the slit
57
is filled with the conductive paste
55
. Here, by the electronic part
54
being pressed upon the upper surface
58
a
of the rubber plate
58
in the direction of an arrow in
FIG. 7
, and the rubber plate
58
being elastically deformed, the conductive paste
55
in the slit
57
is made to adhere to the external surface of the electronic part
54
.
SUMMARY OF THE INVENTION
In the method for coating conductive paste shown in
FIG. 6
, by moving the piston
56
upward to extrude a part of the conductive paste
55
through the opening portion of the slit
53
, the paste is made to adhere to the electronic part
54
. There are cases in which, because too much of the conductive paste
55
is pushed up by the piston
56
, the conductive paste
55
spreads beyond a desired area on the external surface of an electronic part
54
. That is, this method makes it difficult to adjust the quantity of conductive paste
55
to be coated on the external surface of the electronic part
54
.
Further, in the method shown in
FIG. 7
, as the conductive paste
55
usually contains solvent, the action of the solvent causes the rubber plate
58
to swell, and accordingly, there are problems in this method, such as variations in the quantity of the conductive paste
55
to be coated on the external surface of the electronic part
54
and the location of the coating.
An object of the present invention is to present a method for forming an electrode on an electronic component part which is able to securely and easily coat conductive paste only in a desired area of an external surface of an electronic part.
Another object of the present invention is to present a conductive paste coating device which makes it possible to securely and easily coat conductive paste on an external surface of an electronic part only in a desired area.
According to a first aspect of the present invention, a method of forming an electrode on electronic component part is provided. The method comprising includes the steps of filling conductive paste in a slit of a slit plate, a width of the slit being nearly equal to the width of an electrode to be formed at an opening in a first surface of the slit plate, and making an external surface of an electronic part come in contact with and press against the first surface of the slit plate, wherein a rubber plate is on a second surface of the slit plate. The method also include elastically deforming the rubber plate to protrude into the slit to make the conductive paste protrude out the first surface of the slit and adhere to the external surface of the electronic part.
According to a second aspect of the present invention, in a method of forming an electrode of electronic component part, the slit in the slit plate has one part which abuts the rubber plate and has a width larger than the opening in the upper surface of the slit plate.
A conductive paste coating device according to a third aspect of the present invention comprises a slit plate having a slit, one opening in a first surface of the slit plate and which passes through to another opening in a second surface of the slit plate, the slit being dimensioned to have conductive paste fill said slit of the slit plate. The device also includes a rubber plate arranged on a second surface of the slit plate, the rubber plate having an elasticity such that, when an electronic part is made to contact and press against the first surface of the slit plate, the rubber plate is elastically deformed to protrude into the slit.
According to a fourth aspect of the present invention, in a conductive paste coating device, one opening in the first surface of the slit plate has a width wider than the other opening in the second surface of the slit plate.
REFERENCES:
patent: 2543045 (1951-02-01), Murray
patent: 5185040 (1993-02-01), Sakai et al.
patent: 5650199 (1997-07-01), Chnag et al.
Fukuda Makoto
Nakagawa Tadahiro
Burns Doane , Swecker, Mathis LLP
Murata Manufacturing Co. Ltd.
Talbot Brian K.
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