Inflatable sealing system for low temperature electronic module

Details Inflatable sealing system for low temperature electronic module Inflatable sealing system for low temperature electronic module

1999-07-27

2001-10-09

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S046000, C174S017050, C174S050510

Reexamination Certificate

active

06301097

ABSTRACT:

TECHNICAL FIELD
This invention generally relates to electronic modules, and more specifically, to a thermally insulating, inflatable, vapor-proof sealing system and method for a low temperature electronic module such as a cooled multichip integrated circuit module.
BACKGROUND OF THE INVENTION
A wide variety of electronic devices exist in the art. These electronic devices may comprise packaged integrated circuit chips, or bare chips which are unpackaged. Further, multiple integrated circuit chips can be integrated into a single multichip module. Any type of circuitry can be integrated in to the chips, such as digital logic circuitry or memory circuitry or analog circuitry. Also, the circuitry in the chips can be comprised of any type of transistors, such as field effect transistors or bipolar transistors.
One reason for trying to lower the temperature of an electronic module is that its operation may be temperature dependent. For example, a chip comprised of complementary field effect transistors (CMOS transistors) typically increases its speed of operation by approximately 0.3% per ° C. drop in chip temperature.
Thus, in order to increase the performance of CMOS based computers, it is advantageous to reduce the operating temperature of the chips substantially. In doing so, however, applicants have discovered that in reducing surfaces of the module below a room air dew point temperature, water vapor will condense on the exposed surfaces. Similarly, the temperature of the air in the vicinity of the module will decrease because of a cooling effect of the cold air surfaces nearby. This will result in an increase in the relative humidity of the air near the module and could adversely effect device reliability. Therefore, there exists a need in the art for a thermally insulating, vapor-proof sealing system for a low temperature electronic module.
DISCLOSURE OF THE INVENTION
To briefly summarize, the present invention comprises in one aspect a sealing system for an electronic device. The sealing system includes a flexible bladder configured to at least partially surround the electronic device, with thermal insulation disposed within the flexible bladder. A retention cover is provided and configured to hold the flexible bladder against the electronic device.
In another aspect, an electronic device assembly is provided which includes a cooled electronic device and a sealing system. The sealing system includes a flexible bladder configured to at least partially surround the electronic device, with thermal insulation being disposed within the flexible bladder. A retention cover is provided and configured to hold the flexible bladder against the cooled electronic device.
In still another aspect, an electronic device assembly is provided which includes an electronic module and a cold plate thermally coupled to a planar main surface of the electronic module. At least one of an inflatable bladder or a pressurized bladder is provided which is configured to conformally overlay multiple surfaces of the electronic module and the cold plate to prevent air from reaching the multiple surfaces and thereby prevent condensation from forming thereon.
In a further aspect, a method for fabricating an electronic device is disclosed which includes: providing an electronic module; providing a flexible bladder configured to at least partially surround the electronic module, the flexible bladder having thermal insulation disposed therein; and applying a retention cover to the flexible bladder and electronic module to hold the flexible bladder against the electronic module.
In a yet further aspect, a method for fabricating an electronic device assembly is provided which includes: providing an electronic module; providing a cold plate and thermally coupling the cold plate to a planar main surface of the electronic module; and providing at least one of an inflatable bladder or a pressurized bladder configured to conformally engage multiple surfaces of the electronic module and cold plate to prevent air from reaching the multiple surfaces and thereby prevent condensation from forming thereon.
To restate, provided herein is a thermally insulating, inflatable, vapor-proof sealing system and method for a low temperature electronic module such as a multichip module comprised, for example, of CMOS-based integrated circuit chips. The low temperature electronic module is cooled in one example by a refrigeration cold plate. A flexible, inflatable bladder is configured to at least partially surround the low temperature electronic module and when inflated conforms to the surfaces of the module thereby preventing moisture-laden air (i.e., water vapor) from contacting the surfaces of the module. In addition to preventing condensation from forming on the surfaces, the inflatable bladder is preferably filled with thermal insulation, such as a plurality of hollow insulating spheres, which minimize the parasitic heat load on the module. The thermal insulation breaks up any pattern of natural heat convection transfer between inner surfaces of the bladder, as well as any radiant heat transfer between surfaces. Various types of thermal insulation could be employed within the inflatable bladder.
Advantageously, by cooling the electronic module improved performance is achieved, particularly for CMOS-based integrated circuit chips. Condensation due to attaching a cold plate to the module surface is eliminated by inflating the bladder to conformally engage all cooled surfaces of the module to prevent air from contacting the module, thereby preventing a shortening of the life of the electronic module, as well as any printed circuit board to which it is attached, thus ensuring module and board reliability.


REFERENCES:
patent: 4331830 (1982-05-01), Conway et al.
patent: 5208728 (1993-05-01), Schirmer
patent: 5640303 (1997-06-01), Hooley
patent: 5801452 (1998-09-01), Farnworth et al.
Hultmark et al, “Thermal Enhancement of Modules” IBM Technical Disclosure Bulletin, vol. 19, No. 8, Jan. 1977, p. 3127, 361/699.*
R. Baker and J. Mosley, “Inflatable Internal Computer Structure”, IBM Technical Disclosure Bulletin, vol. 39, No. 1, (Jan. 1996), pp. 309-312.

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