Method for effecting reverse shape memory phenomena in Cu-Zn-Si

Details Method for effecting reverse shape memory phenomena in Cu-Zn-Si Method for effecting reverse shape memory phenomena in Cu-Zn-Si

1976-10-04

1978-07-11

Stallard, W.

Metal treatment

Compositions

Heat treating

C22F 108

Patent

active

040999912

ABSTRACT:
A method for making an integrated circuit package includes the steps of fabricating lead frames from a copper-zinc-silicon beta brass alloy and soldering the leads thereof to semi-conductor chips by use of the shape memory and reverse shape memory characteristic of the alloy. The composition of the lead frame material and the choice and sequence of fabrication steps may be varied.

REFERENCES:
patent: 3783037 (1974-01-01), Brook et al.
patent: 4014716 (1977-03-01), Cabo et al.

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