Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
1999-06-09
2001-10-30
Leo, Leonard (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S185000, C174S016300, C257S718000, C257S722000, C361S704000
Reexamination Certificate
active
06308772
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention provides a heat sink structure, especially suitable for dissipating heat from semiconductor equipment such as CPUs.
2. Description of the Prior Art
In semiconductor devices such as very large scale integrated circuits, some of the applied electrical power is consumed by the operation of the semiconductor device, but the surplus is emitted as heat from the outside of the device. Since, in integrated circuits, the semiconductors are concentrated in a small area, the generated heat is concentrated at certain points and temperatures will rise at certain parts of the devices. In equipment using CPUs and MPUs, etc., the thermal performance especially affects the reliability and life of these elements. Recently, both the density of integration of CPUs and MPUs, etc. and their processing speed have been increasing rapidly, and this has been accompanied by an increase in the amount of heat generated. To avoid the problems associated with this, it is normal to provide a heat sink for the heat emitting component which dissipates the heat over a wider area and thus prevents the temperature from rising excessively. If the heat dissipation is not sufficient, it's effectiveness is increased by adding fins.
FIG. 8
is a cross sectional diagram showing a conventional heat sink mounted on a CPU or similar semiconductor device. As shown by
FIG. 8
, a heat radiating plate
53
is arranged on the semiconductor device
51
(CPU, MPU or similar) which is mounted on the surface of wiring board
50
, with foil contact sheet
54
arranged between them in order to improve the thermal conductivity. This heat radiating plate
53
is fixed to wiring board
50
using a method such as soldering. The heat sink
55
is arranged on top of that radiating plate
53
, where the said heat sink
55
and the radiating plate
53
are separated by the foil contact sheet
54
, from each other. The heat radiating plate
53
and the heat sink
55
are securely attached to each other on the thread area
56
raising from the heat radiating plate
53
, by fastening with nuts
57
, to dissipate the heat and cool the equipment. The foil contact sheets are used to improve the contact between the LSI element and the heat radiating plate, and between the heat radiating plate and the heat sink, but in order to improve the thermal conductivity, the connecting surfaces are often coated with a thermally conductive coating of silicon resin.
Conventionally, this type of heat sink structure
55
was formed by die casting etc. out of aluminum or aluminum alloy or other material having good thermal conductivity, and the fins
58
could be formed by machining and cutting. However, as described above, the increasing chip density and processing speed of electronic components is accompanied by increased generation of heat, and so it is necessary to increase the thermal radiation efficiency of heat sink
55
, but unfortunately there is a limit to the amount by which the surface area of fins
58
, which act to dissipate the heat of this type of heat sink, can be increased. Also, this structure uses nuts, etc., to mount the heat sink on the LSI element, and said nuts must be tightened or loosened individually when mounting and removing the structure, which creates a requirement for extra labor.
SUMMARY OF THE INVENTION
In order to overcome the above problems, the present invention provides a heat sink with improved radiation efficiency and which is easy to mount and dismount on LSI and similar elements.
In order to overcome the above-mentioned problem, main present invention provides a heat sink, having a heat conducting section which absorbs and transfers the heat generated by the heat emitting component to which it is connected, and, connected to said heat conducting section, heat dissipating fins which dissipate the heat transferred from the heat conducting section into the ambient air, this heat sink comprising a heat conducting section having a heat absorbing surface connected to the heat emitting component, and a fin section, formed by projecting the surface of said heat conducting section into fins which are integral with the said heat conducting section.
The second present invention provides a heat sink according to the main present invention, having the characteristic that said fins are projected from the heat conducting section in a bag shape (having only one end open).
The third present invention provides a heat sink according to the main present invention, having the characteristic that through holes are made in said fins to allow cooling air to pass.
The fourth present invention provides a heat sink according to the main present invention or third invention, having the characteristic that said fins project vertically and in parallel from the heat conducting section and that multiple fins are arranged in a row.
The fifth present invention provides a heat sink according to the main present invention or the fourth invention, having the characteristic that clamps are provided for the heat conducting section, either as clamps provided directly on the heat emitting component or as clamps mounted on a radiating section attached to the heat emitting component.
The sixth present invention provides a heat sink according to the fifth invention, having the characteristic that the said clamps are arranged on a mounting panel provided between the said heat conducting section and the heat emitting component.
The seventh present invention provides a heat sink according to the main invention or the fourth invention, having the characteristic that the said clamps, used to clamp together the heat conducting section and the heat emitting component, are provided as a separate component from the said heat conducting section.
The eighth present invention provides a heat sink according to main invention or the seventh invention, having the characteristic that the surfaces of the said heat conducting section and fins are painted black.
REFERENCES:
patent: 2965819 (1960-12-01), Rosenbaum
patent: 2984457 (1961-05-01), Wulc
patent: 3187812 (1965-06-01), Staver
patent: 3670215 (1972-06-01), Wilkens et al.
patent: 3694703 (1972-09-01), Wilens et al.
patent: 4356864 (1982-11-01), Ariga et al.
patent: 4605058 (1986-08-01), Wilens
patent: 4712159 (1987-12-01), Clemens
patent: 2013539 (1971-10-01), None
patent: 632686 (1995-01-01), None
patent: 53-89371 (1978-08-01), None
patent: 57-102060 (1982-06-01), None
patent: 5-13629 (1993-01-01), None
Matsumoto Kaoru
Obara Rikuro
Leo Leonard
Minebea Co. Ltd.
Staas & Halsey , LLP
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