Probe plate used for testing a semiconductor device, and a test

Details Probe plate used for testing a semiconductor device, and a test Probe plate used for testing a semiconductor device, and a test

1990-02-05

1991-10-08

Wieder, Kenneth A.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 725, 324158P, G01R 102

Patent

active

050557807

ABSTRACT:
A test apparatus for a semiconductor device is provided to be used for testing, wafer by wafer, a semiconductor device formed on a semiconductor wafer. The test apparatus for a semiconductor device comprises a test head, a probe card and a selection circuit. The probe card has an insulating transparent base plate, and protruding parts are formed on the main surface of the base plate corresponding to electrode pads on a test object semiconductor wafer, and conductive layer forming a prober for the electrode pad is formed on the surface of each of these protruding parts. A wiring layer is formed on the surface opposite to the main surface. The wiring layer and the probers are connected electrically through the through holes provided on the base plate. A prober to be connected to the test head is switched electrically, which makes it possible to test a semiconductor device without moving the corresponding semiconductor wafer.

REFERENCES:
patent: 4647851 (1987-03-01), Dugan
patent: 4719417 (1988-01-01), Evans
patent: 4780836 (1988-10-01), Miyazaki et al.
patent: 4912399 (1990-03-01), Greub et al.
patent: 4912401 (1990-03-01), Nady, II et al.
patent: 4922192 (1990-05-01), Gross et al.
"Flexible Contact Probe", by Greene et al., IBM Tech. Disc. Bull., vol. 15, #5, 10/72, p. 1513.
C. Barsotti et al., "Very High Density Probing," 1988 International Test Conference Paper 30.2, 4/88, pp. 608-614.
B. Leslie et al., "Membrane Probe Card Technology (The Future for High Performance Wafer Test)", 1988 International Test Conference Paper 30.1, 4/88, pp. 601-607.

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