Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2000-02-23
2001-12-04
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S051000, C438S106000, C438S108000, C438S118000, C438S464000, C257S706000, C257S707000
Reexamination Certificate
active
06326233
ABSTRACT:
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to a semiconductor device, a method of fabricating the same, and an electronic apparatus.
Description of the Related Art
In the microminiaturization of semiconductor devices, a bare chip mounting arrangement is regarded as an ideal form of assembly. However, since quality assurance and the handling of a bare chip are difficult, the chip is assembled in a package during semiconductor device fabrication. As one of the package forms meeting the need for high pin counts, a ball grid array (BGA) type package has been developed recently. On a substrate of the BGA type package, external terminal bumps are arranged in an area array to permit surface mounting.
As one kind of BGA type package, there is a tape ball grid array (T-BGA) package in which a film carrier tape is used as a base in fabrication with a tape automated bonding (TAB) technique. In T-BGA packaging using the TAB technique, semiconductor chips can be assembled continuously.
Since the film carrier tape is liable to warp due to lack of rigidity, however, it is required to attach a reinforcing sheet (stiffener). In a process of semiconductor device fabrication, the stiffener is attached to an individual film package punched out after each semiconductor chip is mounted on the film carrier tape. More particularly, the film carrier tape is punched out into separate film packages, and then the stiffener is individually attached.
In this method, after the stiffener has been attached as mentioned above, the film packages must be handled individually in subsequent processes such as bump formation, resulting in trouble in fabrication.
It is therefore an object of the present invention to obviate the above-mentioned drawback by providing a method of fabricating T-BGA packages which are easy to handle, a semiconductor device fabricated by this method, and an electronic apparatus.
SUMMARY OF THE INVENTION
(1) According to a first aspect of the present invention, there is provided a method of fabricating semiconductor devices comprising the steps of: mounting a plurality of semiconductor chips on a film carrier tape; sealing each one of the semiconductor chips mounted on the film carrier tape with a resin; attaching an individual reinforcing member to the film carrier tape at a position corresponding to each one of the semiconductor chips; forming a plurality of external electrodes on the film carrier tape at a position corresponding to each one of the semiconductor chips; and punching out the film carrier tape into separate film packages after above-described steps; wherein each of the steps is carried out on the film carrier tape running between supply and take-up reels.
In this method, the reinforcing member represents any part serving to prevent the film carrier tape from warping (for ensuring planarity). As such a reinforcing member, a so-called stiffener is used in most cases of semiconductor device fabrication.
In this method of the present invention, not only the semiconductor chip mounting step and the resin sealing step, but also the reinforcing member attaching step and the external electrode forming step can be carried out in a continuous reel-to-reel fashion, thereby increasing productivity and reducing manufacturing cost.
(2) The method of the present invention may further comprise a step of bonding a heat spreading member to each one of the semiconductor chips before the step of punching out the film carrier tape.
With this method, since the step of bonding the heat spreading member is also performed before the film carrier tape is punched out, continuous and efficient fabrication can be accomplished. The heat spreading member is used for efficiently dissipating heat from the semiconductor chip and bonded to the semiconductor chip depending on the amount of heat to be produced.
(3) According to a second aspect of the present invention, there is provided a semiconductor device fabricated by using the above-described method.
(4) According to a third aspect of the present invention, there is provided a circuit board comprising the above-described semiconductor device.
(5) According to a fourth aspect of the present invention, there is provided an electronic apparatus including the above-described circuit board.
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Lee Jr. Granvill D
Oliff & Berridg,e PLC
Seiko Epson Corporation
Smith Matthew
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