Heat sink clip assembly

Details Heat sink clip assembly Heat sink clip assembly

2000-10-16

2001-10-23

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C361S710000, C361S719000, C257S719000, C024S453000

Reexamination Certificate

active

06307748

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a clip assembly, and particularly to a clip assembly which readily attaches a heat sink to an electronic device.
2. The Related Art
A heat sink is usually mounted in contact with an electronic device for removing heat therefrom. Various means have been used for attaching heat sinks to be in intimate thermal contact with electronic devices. Common means include using adhesives or clips. However, coefficients of thermal expansion of heat sinks are generally different from coefficients of thermal expansion of adhesives. Thus, a heat sink fastened by adhesive is easily separated from the electronic device during transportation. Moreover, it is extremely difficult to remove such heat sink from the electronic device. This makes repair or replacement of the components impractical.
Conventional clips also pose problems for manufacturers. For example, referring to
FIGS. 10 and 11
, a conventional heat dissipating assembly comprises a heat sink
2
and a plurality of T-shaped clips
1
. Each of two sides of the heat sink
2
defines a slot
22
therein. Each clip
1
comprises a cross arm
12
, and a leg
14
depending from a middle portion of the cross arm
12
. The distal end of the leg
14
defines a catch
16
. In assembly, the cross arm
12
of each clip
1
is received in the slot
22
of the heat sink
2
. The heat sink
2
is placed on an electronic device
3
, with the catch
16
of the clip
1
engaging with a lower portion of the electronic device
3
.
However, this conventional clip assembly has many shortcomings. First, the clip must be manufactured to a given size required by the design of a particular heat sink. Every differently sized heat sink requires a new differently sized clip. Secondly, the engaging force of the clip is limited. Thirdly, the process of inserting the clip into the slot requires great precision of movement. The process often results in deformation or even breakage of the clip. Fourthly, the clip does not prevent the heat sink from moving in a lateral direction relative to the electronic device. U.S. Pat. No. 5,730,210 discloses a single fastening bolt cooperating with a spring to fasten a heat sink to the CPU on the mother board. This type design also requires unconformable laborious forcible insertion to have the inherent expansion head of the bolt extend through the fixing hole in the mother board for retention.
A new heat sink clip assembly is desired to overcome the above-mentioned problems of the prior art.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a clip assembly for a heat sink which readily attaches the heat sink to an electronic device.
Another object of the present invention is to provide a clip assembly for securely attaching a heat sink to an electronic device.
To achieve the above-mentioned objects, a clip assembly in accordance with the present invention comprises a nail member, a sleeve member, and a spring around the sleeve member. The nail member includes a cap, a post, a neck, and a cone-shaped barb at a bottom end. A pair of wedges is formed on an outer surface of the post. The sleeve member is cylindrical. An upper main portion of the sleeve member defines a central bore for receiving the nail member, and a pair of rectangular slots for receiving the wedges of the nail member. A circumferential shoulder is formed on the main portion, for abutting against a bottom surface of a heat sink. A lower portion of the sleeve member defines cutouts, thereby also forming deformable fingers. The sleeve member is interposed between the heat sink and a PCB. The nail member is inserted down through the lower portion, and elastically expands the fingers of the sleeve member.
Other objects, advantages and novel features of the present invention will be apparent from the following detailed description of preferred embodiments of the present invention with reference to the attached drawings, in which:


REFERENCES:
patent: 5384940 (1995-01-01), Soule et al.
patent: 5730210 (1998-03-01), Kou
patent: 5748446 (1998-05-01), Feightner et al.
patent: 5757621 (1998-05-01), Patel
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 6252768 (2001-06-01), Lin

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