Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
1999-11-18
2001-07-24
Bradley, Paula (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S071000, C439S525000, C439S862000
Reexamination Certificate
active
06264479
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a handler socket intervening between an electrical part such as a semiconductor device (hereinafter referred to as an IC package) and a circuit substrate for connecting the electrical part with the circuit substrate.
BACKGROUND ART
In a conventional “handler”, as described in Japanese Unexamined Patent Publication No. 10-113580, a large number of IC carriers each accommodating the IC package are mounted on a test tray so that the test tray is conveyed with the IC carriers.
Although not described in the above mentioned publication, a large number of handler sockets are arranged in predetermined positions on the circuit substrate associated with an IC tester.
After positioning of the IC carriers conveyed by the test tray to the handler sockets, respectively, the IC packages accommodated in the IC carriers are pressed downward by a contact pressure element so that terminals of the IC packages are pressed against the handler sockets so that the IC packages are electrically conducted to the circuit substrate through the corresponding handler sockets.
Each of the handler sockets comprises a socket body and a large number of contact pins disposed thereto. Each of the contact pins is adapted to contact with each of the terminals of the IC package and the circuit substrate, thereby electrically connecting the IC package and the circuit substrate.
With the electrical connection between the circuit substrate of the IC tester and each IC package, a test of each IC package is carried out by the IC tester and, on the basis of the tested result, each IC package is sorted into non-defective and defective ones.
In such a conventional handler, however, the handler sockets must be positioned to both of the IC carriers and the circuit substrate, respectively. In addition, it is necessary to determine a number of the contact pins and pitches therebetween to correspond to the terminals of the IC package.
Therefore, in a case where the positioning portions of the IC carriers or those of the circuit substrate change, or where the number of terminals of the IC package and the pitches therebetween change, to replace all of the handler sockets must be required, resulting in higher costs of the handler.
It is therefore the object of the present invention, even in the case where the positioning portions of the IC carriers or those of the circuit substrate change, or where the number of terminals of the IC package and the pitches therebetween change, to provide a handler socket capable of achieving a partial sharing or common use of its elements.
DISCLOSURE OF THE INVENTION
In order to achieve such object, according to one aspect of the present invention, there is provided a handler socket having confronting surfaces adapted to be connected to an electrical part and a circuit substrate for an electrical conduction between the electrical part and the circuit substrate, the handler socket comprising a socket body; a plurality of contact pins contacting with the electrical part and the circuit substrate so as to electrically connect the electrical part with the circuit substrate; and a holder holding the plurality of contact pins and adapted to be engaged with the socket body; each of the contact pins having a contact portion and being held to the holder so that the contact portion projects from the confronting surfaces, the holder being removably mounted on a side of the socket body.
In the handler socket according to one aspect of the present invention, since the holder holding the plurality of contact pins is removably mounted on the side of the socket body, in a case where an IC carrier or the circuit substrate is replaced, or where electrical parts have different numbers of terminals with the same or different intervals therebetween, it is able to cope with the replacement or the difference of the numbers of terminals or the intervals by merely replacing one of the holder and the socket body, making it possible to consequently achieve the sharing or the common use of elements of the other thereof.
According to another aspect of the present invention, the holder holding a different number of the contact pins and/or different intervals therebetween is permitted to be mounted on the socket body.
According to further aspect of the present invention, the socket body is formed with positioning portions by which the electrical part or the circuit substrate is positioned, so that the socket body including the positioning portions which have different locations and different shapes is enabled to be mounted on the holder.
According to still further aspect of the present invention, each of the contact pins has a substantially U-shape, the contact portion being formed close to an end portion of each of the U-shaped contact pins.
In the still further aspect of the present invention, since each of the contact pins has a substantially U-shape and the contact portion is formed close to an end portion of each of the U-shaped contact pins, it is possible to reduce the thickness of the handler socket while simultaneously allowing the same contact pressure to be applied to the both end portions of each of the contact pins, thereby improving a stability of contact. Furthermore, each of the U-shaped contact pins makes short a flow path of a current, and therefore, it is possible to make the handler socket suitable for the testing of the IC packages by using a high frequency.
According to still further aspect of the present invention, the contact portion of each of the contact pins has a projection shape which projects outwardly of the U-shaped portion, and an amount of the projection of the contact portion of the electrical part side, to which the electrical part is connected, from the confronting surfaces is set to be larger than an amount of the projection of the contact portion of the circuit substrate side, to which the circuit substrate is connected, therefrom.
In the still further aspect of the present invention, since the contact portion of each of the contact pins has a projection shape which projects outwardly of the U-shaped portion so that an amount of the projection of the contact portion of the electrical part side, to which the electrical part is connected, from the confronting surfaces is set to be larger than an amount of the projection of the contact portion of the circuit substrate side, to which the circuit substrate is connected, therefrom, it is possible to suitably contact the contact portion of the electrical part side with a terminal of the electrical part.
According to the still further aspect of the present invention, while the holder is mounted on the socket body, wherein an end portion of each of the contact pins is engaged with a contact pin engagement portion of the socket body so that each of the contact pins is subjected to a pre-load.
In the still further aspect of the present invention, because, while the holder is mounted on the socket body, an end portion of each of the contact pins is engaged with a contact pin engagement portion of the socket body so that each of the contact pins is subjected to a pre-load, it is possible to improve an alignment of the contact pins and make each height of each contact portion uniform.
According to still further aspect of the present invention, the holder is provided with insulating walls interposed between the contact pins and adapted to insulate the contact pins, each of the insulating walls being adapted to be fitted into a fitting recess portion, the fitting recess portion being formed in the socket body.
In the still further aspect of the present invention, because the holder is provided with insulating walls interposed between the contact pins and adapted to insulate the contact pins so that each of the insulating walls is adapted to be fitted into a fitting recess portion formed in the socket body, it is possible to improve a workability of mounting the holder and a positional accuracy thereof, thus presenting a useful effect in practical use.
REFERENCES:
patent: 4470650 (1984-09-01), Lundergan
pat
Bradley Paula
Enplas Corporation
Fish & Richardson P.C.
Ta Tho D.
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