Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Utility Patent
1999-12-14
2001-01-02
Ryan, Patrick (Department: 1725)
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
C228S006200, C228S008000, C228S049100, C148S558000
Utility Patent
active
06168063
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an ultrasonic vibration bonding machine capable of mounting a semiconductor chip on the surface of a circuit board by ultrasonic vibration.
2. Description of the Prior Art
As disclosed by Japanese Laid-open Patent Application No. 10-22308, the present applicant has proposed an ultrasonic vibration bonding machine which is suitable for mounting a semiconductor chip on the surface of a circuit board by ultrasonic vibration.
Since a passage for absorbing and adsorbing a semiconductor chip is formed from the maximum vibration point to the minimum vibration point of a resonator in the above ultrasonic vibration bonding machine, it takes much labor and time to form the passage.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an ultrasonic vibration bonding machine which can simplify a suction passage structure.
According to a first aspect of the present invention, there is provided an ultrasonic vibration bonding machine for bonding the metal portions of a first material to the metal portions of a second material by ultrasonic vibration transmitted from a transducer to a resonator in such a manner that the first material is mounted on a mounting unit, the second material is absorbed and adsorbed to the bonding working portion of the resonator supported by an ultrasonic vibration bonding unit separated from the mounting unit and located above the mounting unit at both sides, a measuring unit inserted between the first material and the second material without contact measures the positions of the metal portions provided on the top surface of the first material and the positions of the metal portions provided on the under surface of the second material to drive the mounting unit so that the metal portions of the first material are aligned with the metal portions of the second material, and the resonator falls to bond the metal portions of the first material to the metal portions of the second material under pressure, wherein
the resonator has a suction passage for absorbing and adsorbing the second material at the maximum vibration amplitude point where the bonding working portion is provided.
According to a second aspect of the present invention, there is provided an ultrasonic vibration bonding machine, wherein the suction passage and a suction hose connected to the suction passage are made separate units which can be connected and disconnected.
According to a third aspect of the present invention, there is provided an ultrasonic vibration bonding machine, where in the resonator has heaters at the minimum vibration amplitude points.
The above and other objects, features and advantages of the invention will become more apparent from the following description when taken in conjunction with the accompanying drawings.
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Nakai Seiya
Sato Shigeru
Cooke Colleen
Kanesaka & Takeuchi
Ryan Patrick
Ultex Corporation
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