Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-02-09
2001-09-11
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C257S722000, C361S703000
Reexamination Certificate
active
06288899
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to a method and apparatus for heat dissipation. More specifically, this invention relates to heat dissipation in a circuit assembly, such as a multi-processor module, in which electronic components are positioned adjacent one another along the path of cooling air flow.
BACKGROUND OF THE INVENTION
As microprocessor frequencies increase in newly-developed computer systems, the power requirements for the processor components can create significant challenges. For example, in order to meet the dynamic power requirements of such systems, power modules are preferably placed in close proximity to the respective processor components. These factors make adequate heat dissipation important to system performance.
In some configurations, the flow path of cooling air is designed such that the cooling air passes the processor components first and then passes their respective power modules. On the other hand, other packaging schemes may have this air flow direction reversed in order to optimize the mechanical packaging of the system as well as the system's performance. In other words, the air flow path in such systems is designed so that the air passes the power modules first and then passes their respective processor components.
Power modules are often relatively large in comparison to the processor components and can limit the accessibility of the cooling air flow to the processor components when the power modules are positioned upstream of the processor components. The power modules also tend to dissipate a significant amount of heat and can add significant heat to the processor component area. Accordingly, cooling air used to dissipate heat from the processor components is preheated by the power modules before the cooling air reaches the processor components. This preheating effect adds an additional burden on the cooling system.
There remains a need for a method and apparatus for heat dissipation that can be used advantageously in systems in which electronic components are positioned adjacent one another along the path of cooling air flow. More specifically, a method and apparatus is needed that can be used in connection with the cooling of a power module to improve the cooling of an adjacent processor component when the power module is positioned upstream of the processor component. More broadly, there is a need for a method and apparatus for heat dissipation for use in systems in which multiple heat sources are positioned along the path of cooling air flow, where the dissipation of heat from the downstream heat source may be important.
SUMMARY OF THE INVENTION
This invention provides a heat sink for dissipating heat from an electronic component to be cooled by air flow. The heat sink includes a base configured to be mounted to the electronic component to receive heat transferred from the electronic component. The base has a center extending along the direction of air flow.
The heat sink also includes a plurality of fins projecting from the base. Each of two adjacent fins is positioned on opposite sides of the center of the base and is spaced laterally from the center of the base. The adjacent fins therefore define a gap extending across the center of the base. The gap between the adjacent fins reduces the temperature increase of air flowing adjacent the center of the base.
This invention also provides a circuit assembly including an electronic component to be cooled by air flow; a heat sink according to this invention; and an adjacent electronic component, also to be cooled by air flow, located downstream of the electronic component. The gap between the adjacent fins of the heat sink reduces the temperature increase of air flowing adjacent the center of the base of the heat sink to the adjacent electronic component.
This invention further provides a method for cooling an electronic component and for reducing the temperature increase of cooling air flowing to an adjacent electronic component located downstream of the electronic component. The method includes mounting to the electronic component a heat sink according to this invention. Air is urged through the gap between the adjacent fins of the heat sink, thereby reducing the temperature increase of air flowing adjacent the center of the base of the heat sink to the adjacent electronic component.
REFERENCES:
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patent: 5519575 (1996-05-01), Chiou
patent: 5771153 (1998-06-01), Sheng
patent: 5815371 (1998-09-01), Jeffries
patent: 5835347 (1998-11-01), Chu
patent: 5927386 (1999-07-01), Lin
patent: 6067227 (2000-05-01), Katsui
patent: 6118656 (2000-09-01), Wang
patent: 6145586 (2000-11-01), Lo
Ratner & Prestia
Rode Lisa A.
Starr Mark T.
Tolin Gerald
Unisys Corporation
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