Abrading – Accessory – Dressing
Reexamination Certificate
1998-12-22
2001-01-23
Silverman, Stanley B. (Department: 1731)
Abrading
Accessory
Dressing
C501S089000, C501S130000, C501S131000, C501S141000, C501S154000, C264S036180, C264S679000, C264S682000, C264S642000, C264S643000, C156S250000, C156S268000, C428S034400, C428S325000, C428S453000, C428S454000, C428S688000, C428S428000, C083S174000, C427S419700, C125S002000
Reexamination Certificate
active
06176769
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a ceramics dress substrate capable of both cutting work and dressing a grindstone during cutting.
2. Description of the Related Arts
When a material such as hard-cut ceramics is cut, clogging of the grindstone raises a problem. When the clogging is generated, cutting resistance of the grindstone is increased and no material can be precisely cut, thereby exerting an influence on the yield of the processed product.
To solve such a problem, dressing of the grindstone is conventionally performed. The dressing is generally intermittently performed between cutting work processes.
Porous alumina sintered at a high temperature of 1600° C. or higher by adding an oxide such as MgO, CaO, and the like to alumina, and a material obtained by adding feldspar or artificial frit to uniformed ceramics grinding particles are known as a dress substrate.
However, since the above porous alumina is sintered at a high temperature of 1600° C. or higher, each of the above alumina particles becomes round so that the performance of the dressing substrate cannot be sufficiently fulfilled.
Moreover, the material obtained by adding feldspar or artificial frit to the uniformed ceramics grinding particles can be sintered at a temperature lower than 1600° C. so that each of the grinding particles does not become round. Accordingly, the performance of the dressing substrate can be sufficiently fulfilled. However, since the feldspar or artificial frit enters clearances of the ceramics grinding particles, the dressing substrate is closely formed and thus the dressing substrate itself is hardened. Therefore, wear of the cutting grindstone is increased and the life of the grindstone is shortened. Further, the cutting resistance value is increased and the cut material cannot be precisely cut.
Japanese Laid-Open Patent Publication No. 53-89364 discloses an art to overcome the clogging of the grindstone by producing a dress substrate with silica. Although the clogging problem is solved, dressing of the diamond grindstone is still insufficient. Further, this art cannot be used for both cutting work and dressing.
Japanese Laid-Open Patent Publication No. 1-188267 discloses a dress substrate using a glass material as a base material. However, similar to the material obtained by adding feldspar or artificial frit, the dress substrate is hardened and the wearing amount of the grindstone is increased, and thus the life of the grindstone is shortened. Moreover, the cutting resistance value is increased and cutting accuracy is low.
The cut material and the dress substrate are adhered to each other by a melted solder material. Therefore, when resin is used as a mold material of the dress substrate, a problem exists in that the resin is deformed at a melting temperature of the solder material ranging from 100 to 150° C.
SUMMARY OF THE INVENTION
In consideration of such conventional problems, the present invention provides a ceramics dress substrate capable of both cutting work with high accuracy and dressing the cutting grindstone, and having an excellent cutting property with reduced wearing of the grindstone.
The ceramics dress substrate in this invention comprises sintering a mixture of ceramics grinding particles and a silicate mineral.
The ceramics dress substrate of the present invention comprises sintering the ceramics grinding particles and the silicate mineral.
Here, the ceramics grinding particles mainly function as dressing a grindstone.
When the grinding particles are small, no grindstone can be sufficiently dressed. Conversely, when the grinding particles are large, wear of the grindstone may possibly increase. When the grinding particle size is varied, the dressing property of the grindstone cannot be stabilized. Accordingly, it is preferable if the ceramics grinding particles are uniform without unevenness in particle size.
In the present invention, as the ceramic grinding particles included in the ceramic dress substrate are uniformed, problems caused by the unevenness in grinding particles as mentioned above can be avoided, leading to a stable cutting resistance. Accordingly, life of the grindstone can be lengthened by performing the cutting work using the ceramic dress substrate of the present invention so that the cost of the cutting work is reduced.
Further, since the silicate mineral functions as a binding material of the ceramic grinding particles, the mixture with the ceramic grinding particles can be sintered even at a temperature lower than 1600° C. Therefore, no ceramic grinding particles become round so that each of the ceramic grinding particles can remain sharp. Accordingly, excellent cutting properties are obtained and the amount of ware of the grindstone can be restrained.
The ceramic dress substrate of the present invention is capable of both performing a cutting with high accuracy and dressing a diamond cutting grindstone, with excellent cutting properties and reduced wear of the grindstone. Further, coating the surface of the ceramic dress substrate with glass leads to giving added value thereto. Namely, the cut material can be adhered to the dress substrate by a solder material so that the dress substrate can be directly vacuum adsorbed to the stage of a precision cutting machine.
REFERENCES:
patent: 4667650 (1987-05-01), Girard et al.
patent: 4719151 (1988-01-01), Chyung et al.
patent: 5306554 (1994-04-01), Harrison et al.
patent: 5679119 (1997-10-01), Freeman et al.
patent: 2-303768 (1990-12-01), None
patent: 9-309070 (1997-12-01), None
Matsuyama Shirohito
Okamoto Naoyuki
Shimizu Kazutoyo
Sugita Katsushi
Suzuki Masato
Colaianni Michael P.
Narumi China Corporation
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Silverman Stanley B.
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