Method for surface mounting a coil

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29840, 336192, 336205, 361400, H01F 4106, H05K 334

Patent

active

047591200

ABSTRACT:
A coil is wound either with insulated wire or space wound with uninsulated wire and subsequently coated with a solder resist or insulating material. If insulated wire is used, the insulation is removed from the wire either during or after winding at predetermined locations to match the location of connection pads in a conductive pattern on a substrate. The coil is appropriately aligned and laid down on the substrate and an attachment technique is used to form an electrical connection between the exposed areas of wire and connection pads on the substrate. Alternatively, uninsulated wire may be used, which is space wound and coated with a solder resist or insulating material. The uninsulated wire may either be masked prior to coating or the insulating material may be removed following coating to form exposed connection locations on the coil corresponding to the location of the connection pads on the substrate. An attachment technique is then used to form an electrical connection between the exposed areas of wire and the corresponding connection pads on the substrate.

REFERENCES:
patent: 3824518 (1974-07-01), Slenker
patent: 4236295 (1980-12-01), Nakamura
patent: 4507637 (1985-03-01), Hayashi

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for surface mounting a coil does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for surface mounting a coil, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for surface mounting a coil will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-251871

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.