Heat sink assembly with adjustable mounting clip

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361695, 361709, 361710, 361697, 361717, 257718, 257719, 257722, 257727, 165 802, 165 803, H05K 720

Patent

active

058256229

ABSTRACT:
A heat sink assembly with an adjustable and customizable mounting clip is provided. The length of the mounting clip can be precisely adjusted to accommodate integrated circuit device sockets of varying lengths. Unused legs of the mounting clip can be completely removed to accommodate neighboring circuit board components. With the mounting clip adjusted and legs selected, a heat sink member is threaded through the top planar member of the mounting clip into flush thermal communication with the top surface of an integrated circuit device to effectuate heat dissipation therefrom.

REFERENCES:
patent: Re35573 (1997-07-01), Clemens
patent: 2913159 (1959-12-01), O'Neill
patent: 3033537 (1962-05-01), Brown, Jr.
patent: 3229756 (1966-01-01), Keresztury
patent: 4345267 (1982-08-01), Corman et al.
patent: 4607685 (1986-08-01), Mitchell, Jr.
patent: 4660123 (1987-04-01), Hermann
patent: 4745456 (1988-05-01), Clemens
patent: 5313099 (1994-05-01), Tata et al.
patent: 5397919 (1995-03-01), Tata et al.
patent: 5708564 (1998-01-01), Lin

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