Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
1999-01-22
2001-08-28
Meier, Stephen D. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S118000, C438S460000
Reexamination Certificate
active
06281045
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of Invention
The present invention relates to a semiconductor apparatus, method of manufacturing the same and an electronic apparatus having the same.
2. Description of Related Art
Ball Grid Array (BGA) type packages and Chip Size/Scale Package (CSP) type packages are attracting attention as the performance of semiconductor apparatuses further improve. BGA type packages can meet requirements for smaller size semiconductor apparatuses having an increased number of pins. CSP type packages can also meet requirements for smaller size semiconductor apparatuses.
Conventionally, packages are individually formed for semiconductor chips one by one, which results in a lowered productivity. Also, when a semiconductor apparatus is miniaturized or provided with a great number of pins, a heat radiation plate is attached thereto to improve the heat radiation efficiency. Heat radiation plates are individually attached to semiconductor chips one by one during the package forming process. Japanese Laid-open Patent Application HEI 8-107161, the subject matter of which is incorporated herein by reference, describes a method in which a plurality of semiconductor chips are first provided in a package configuration and then the package is cut into individual chips. However, this reference does not suggest the attachment of any heat radiation plate.
Accordingly, conventional manufacturing processes do not meet requirements for increasing productivity and reducing costs.
SUMMARY OF THE INVENTION
The present invention solves the above-described problems. It is an object of the present invention to provide a semiconductor apparatus, a method of manufacturing the same and an electronic apparatus that achieves excellent productivity and reduces the manufacturing costs.
A method of manufacturing a semiconductor apparatus according to the present invention may include a step of attaching a plurality of semiconductor devices to a substrate, a step of sealing each of the semiconductor devices with resin, a step of attaching a heat radiation plate and a step of cutting the substrate and the heat radiation plate corresponding to each of the semiconductor devices.
A plurality of semiconductor apparatuses may be simultaneously formed in a package configuration and cut into separate pieces. As a consequence, productivity is improved and the manufacturing cost is reduced. Furthermore, the heat radiation plate may also be cut into pieces at the same time. As a result, semiconductor apparatuses having improved heat radiation efficiency are provided without individually attaching a heat radiation plate to each of the semiconductor apparatuses.
After the heat radiation plate is attached to the semiconductor devices, resin may be injected between the substrate and the heat radiation plate.
As a result, the resin may be injected in an area defined by the substrate and the heat radiation plate.
In accordance with the manufacturing method according to the present invention, a metal mold may be brought into a tight contact with an opening section defined at sides of the substrate and the heat radiation plate. The resin may be injected into a space defined by the substrate, the heat radiation plate and the metal mold. As a result, the resin can be prevented from flowing out of the substrate.
In accordance with the manufacturing method according to the present invention, the substrate having the semiconductor devices and the heat radiation plate attached thereto may be disposed in a cavity defined by an upper metal mold and a lower metal mold. The resin may be injected between the substrate and the heat radiation plate. As a result, resin sealing may be achieved within the upper and lower metal molds.
In accordance with the manufacturing method according to the present invention, a plurality of opening sections may be formed in the heat radiation plate, and the periphery of the substrate having the semiconductor devices attached thereto may be surrounded by a frame member. The heat radiation plate may be disposed on the frame member, and the resin may be injected through the opening sections of the heat radiation plate. As a result, a metal mold is not required when resin is injected.
In accordance with the manufacturing method according to the present invention, each of the opening sections in the heat radiation plate may be formed between adjacent ones of the semiconductor devices, and on cutting lines of the heat radiation plate. The radiation plate may be readily cut by disposing the opening sections on the cutting lines.
In accordance with the manufacturing method according to the present invention, resin is provided to cover all of the semiconductor devices on one surface of the substrate, and the heat radiation plate is pressed against the resin. As a result, the resin is provided by a potting method, and accordingly, the resin sealing process is readily performed.
A semiconductor apparatus in accordance with the present invention may be manufactured by the methods described above.
An electronic apparatus in accordance with the present invention may also have circuit board including a semiconductor apparatus mounted thereon.
Other objects, advantages and salient features of the invention will become apparent from the following detailed description taken in conjunction with the annexed drawings which disclose preferred embodiments of the invention.
REFERENCES:
patent: 5083191 (1992-01-01), Ueda
patent: 5547906 (1996-08-01), Badehi
patent: 5977629 (1999-11-01), Fogal et al.
patent: 8-107161 (1996-04-01), None
Meier Stephen D.
Oliff & Berridg,e PLC
Seiko Epson Corporation
Vockrodt Jeff
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