Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
1998-10-26
2001-04-17
Loke, Steven (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S673000, C257S696000, C257S738000, C257S778000, C257S784000
Reexamination Certificate
active
06218728
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to a mold-BGA (ball grid array)-type semiconductor device and a method for making the same. BGA means to connect arranging an array of ball solders on a main plane of substrate.
BACKGROUND OF THE INVENTION
A conventional mold-BGA-type semiconductor device is, as shown in
FIGS. 1A and 1B
, structured by adhering a buffering elastic material called elastomer
10
onto the surface of a chip
1
, thermo-compression-bonding a copper wiring
12
to a pad
2
of the chip
1
, sealing with a sealant
13
.
FIG. 1A
shows a state that the pad
2
is disposed at the center of the chip
1
, and
FIG. 1B
shows a state that it is disposed peripherally.
Also, Japanese patent application laid-open Nos. 3-94438 (1991) and 8-204062 (1996) disclose examples of mold-BGA-type semiconductor devices where solder balls are disposed on the surface of resin package on the front-face side of semiconductor chip.
As one example of them, the semiconductor device disclosed in Japanese patent application laid-open No. 3-94438 (1991) is shown in
FIGS. 2A and 2B
.
FIG. 2A
is a cross sectional view showing the semiconductor device before forming the solder balls, and
FIG. 2B
is a cross sectional view showing the semiconductor device after forming the solder balls.
As shown in
FIG. 2A
, it is fabricated by forming a dummy support
15
uniting with a die pad
14
on which a semiconductor chip
1
is to be mounted, adhering the semiconductor chip
1
onto the die pad
14
, bonding between the pad
2
of the semiconductor chip
1
and the dummy support
15
through a wire
5
(metal thin wire), resin-sealing the whole members. After resin-sealing, as shown in
FIG. 2B
, outsides from the line B-B′ and line C-C′ in
FIG. 2A
are cut down and separated, thereby allowing part where the semiconductor chip
1
is mounted to be remaining. The surface of the remaining part and the wire
5
are polished to expose the surface of wire
5
until having a predetermined thickness. Solder balls
6
are formed on the exposed and polished part of the wire
5
.
However, in the BGA-type semiconductor device in
FIGS. 1A and 1B
, there are the problems that the cost for material becomes expensive because the wiring structure from the pad
2
to the solder ball
6
uses a polyimide tape
11
and the elastomer
10
, and that the fabrication process is complicated because of the adhering structure.
Also, in the BGA-type semiconductor device in
FIGS. 2A and 2B
, there is the problem that the cost for material becomes expensive because the dummy support
15
is used.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the invention to provide a mold-BGA-type semiconductor device where the connection with solder ball through wire can be made at a lower cost.
It is a further object of the invention to provide a method for making a mold-BGA-type semiconductor device where the connection with solder ball through wire can be made at a lower cost.
According to the invention, a mold-BGA-type semiconductor device, comprises:
a semiconductor chip which includes insulating resin film formed on at least a part of the surface of the semiconductor chip except a pad;
a conductive layer formed in a region on the insulating resin film, the region including at least part corresponding to a position where a solder ball is mounted;
a first metal thin wire which is wire-bonded between the pad and the conductive layer;
a second metal thin wire which is wire-bonded on the conductive layer;
resin part which seals the semiconductor chip, the resin part including a hole to expose part of the second metal thin wire; and
a solder ball which is mounted on the hole.
According to another aspect of the invention, a method for making a mold-BGA-type semiconductor device, comprises the steps of:
forming insulating resin film on at least a part of the surface of a semiconductor chip except a pad;
wire-bonding between the pad and the conductive layer and wire-bonding on the conductive layer;
resin-sealing the semiconductor chip;
forming a hole through the sealing resin to expose part of a metal thin wire which is wire-bonded on the conductive layer; and
mounting a solder ball on the hole.
REFERENCES:
patent: 5311057 (1994-05-01), McShane
patent: 5528083 (1996-06-01), Malladi et al.
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5841191 (1998-11-01), Chia et al.
patent: 5864174 (1999-01-01), Yamada et al.
patent: 6001723 (1999-12-01), Kelkar et al.
patent: 6028356 (2000-02-01), Kimura
patent: 6107682 (2000-08-01), Fjelstad
patent: 3-94438 (1991-04-01), None
patent: 8-204062 (1996-08-01), None
Loke Steven
Nadav Ori
NEC Corporation
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