Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
1999-06-01
2001-08-21
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S583200, C438S464000, C029S426600
Reexamination Certificate
active
06277234
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to the post processing stage in the manufacture of semiconductor work pieces. More particularly, the present invention relates to an apparatus and method for releasing work pieces from a mounting tape.
BACKGROUND OF THE INVENTION
Semiconductor work pieces, such as wafers, reticules, masks, frame leads, and integrated circuit packages are very small devices which are easily moved and even more easily broken. Conventionally, during processing, work pieces are adhered to a high adhesive tape, such as, for example, Nitto tape. After processing, the wafers are typically removed from the tape. It is imperative that the wafers be removed without being damaged, which is often difficult given that the adhesive tape used generally has high adherent characteristics.
There is, thus, a need in the industry for a low cost and effective method and apparatus for releasing work pieces from an adhesive material, for example, a tape without breaking the work piece.
SUMMARY OF THE INVENTION
The present invention provides a demounting apparatus which includes a conduit, a demounting mechanism, and a support structure having an adhered work piece which is to be removed. The conduit has a pair of opposed openings and a vacuum port. The demounting mechanism includes a vacuum source which exerts a vacuum through the vacuum port. The support structure is supported by the conduit and placed over one of the openings. The work piece is mounted on an undersurface of the support structure and the vacuum is exerted, causing the support structure to elastically deform. The deformation and the force of the vacuum combine to release the work piece from the support structure.
The present invention also provides a method of demounting a work piece. The method includes placing a support structure, which has a work piece affixed to a lower surface thereof, over an opening in a demounting apparatus, creating a pressure differential between an interior of the demounting apparatus and an exterior position near the demounting apparatus, such as by exerting a vacuum through the interior of the demounting apparatus to thereby pull a work piece away from the support structure.
These and other features and advantages of the invention will become more apparent from the following detailed description of preferred embodiments of the invention which is provided in conjunction with the accompanying drawings.
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Freund Joseph Michael
Przybylek George John
Romero Dennis Mark
Dickstein , Shapiro, Morin & Oshinsky, LLP
Lucent Technologies - Inc.
Osele Mark A.
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