Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2000-03-17
2001-03-13
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S106000
Reexamination Certificate
active
06200831
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device, a process for production thereof, and a surface-protecting film. More particularly, the present invention relates to a resin-sealed semiconductor device obtained by resin-sealing a semiconductor element whose surface is coated with a polyimide, a process for production thereof, and a surface-protecting film suitable for protection of a semiconductor element.
2. Description of the Related Art
In the conventional production of a resin-sealed semiconductor device, it is conducted, for the surface protection of semiconductor element or for the prevention of semiconductor element malfunctioning caused by the &agr;-ray emitted from sealing resin, to form a surface-protecting film of a polyimide resin on the surface of a semiconductor element and then conduct sealing with a molding resin.
Mounting of such a resin-sealed semiconductor device is now conducted mainly by surface mounting. In the surface mounting, the leads of semiconductor device and the wires of printed wiring board are temporarily connected, and the semiconductor device and the wiring board are heated to conduct soldering. The heating is conducted mainly by a method of using a radiant heat of infrared rays (infrared reflowing) or a method of using a condensation heat of fluorine-based inert fluid (vapor phase reflowing).
In such surface mounting, it occurs in some cases that the water absorbed inside a resin-sealed semiconductor device is rapidly vaporized by the heat applied during soldering and the resulting vapor pressure allows the sealing member (resin) of said device to generate cracking. This cracking poses a serious problem with respect to the reliability of semiconductor device [Transactions of the Japan Society of Mechanical Engineers (A), 55 (510), 356-363 (1989)].
SUMMARY OF THE INVENTION
The first object of the present invention is to provide a semiconductor device capable of preventing the cracking and peeling of the sealing member during soldering. The second object of the present invention is to provide a process for producing such a semiconductor device. The third object of the present invention is to provide a surface-protecting film suitably used in such a semiconductor device.
According to the present invention, the peeling and cracking of sealing member occurring during soldering can be prevented by the use of a polyimide film formed from a polyimide precursor having polar substituents as the side chains.
REFERENCES:
patent: 5858584 (1999-01-01), Okabe et al.
Isoda Keiko
Kataoka Fumio
Kikkawa Haruhiko
Obara Isao
Tanaka Jun
Antonelli Terry Stout & Kraus LLP
Hitachi , Ltd.
Nelms David
Nhu David
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