Computer package with a polygonal shaped motherboard

Details Computer package with a polygonal shaped motherboard Computer package with a polygonal shaped motherboard

1997-09-19

1999-05-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361683, 361697, 361721, 361735, 439 61, 165 803, 165105, 60228, H05K7/20

Patent

active

059034327

ABSTRACT:
An electronic assembly that includes a plurality of electronic substrates that are plugged into a polygonal shaped motherboard. The polygonal shape of the motherboard minimizes the electrical path between electronic substrates while providing enough space between adjacent substrates to allow a fluid to sufficiently remove heat generated by integrated circuits of the substrates.

REFERENCES:
patent: 3434014 (1969-03-01), Taynton
patent: 3785895 (1974-01-01), Ettre et al.
patent: 3942586 (1976-03-01), Fries
patent: 5060111 (1991-10-01), Takashima
patent: 5483422 (1996-01-01), Bowen et al.
patent: 5706650 (1998-01-01), Thayer
patent: 5716220 (1998-02-01), Siroky

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